Abstract: Apparatus for soldering a plurality of conductors simultaneously to a printed circuit board or suitable connector card and having a controlled pressure-temperature cycle. The apparatus comprises a heater bar mounted on one end of a frame which is vertically pivotable about a support bracket. The support bracket is mounted to a generally flat, rectangular base for receiving a cable to be soldered. The heater bar is formed from metallic bar stock having a rounded contacting end. Two channels are formed along the length of the heater bar: a heating channel holds a resistance heating element, and a cooling channel is connected at one end to a supply of compressed air. The vertical motion and contact pressure of the pivoting frame-heater bar assembly is controlled by a timer which vents compressed air to an air cylinder connected to the frame.