Abstract: A compliant pin for preferable insertion into a multi-layer backpanel is disclosed. The pin includes a wire-wrap area, a pin stop, and a connector area. Between the connector area and the stop there is located the compliant area which forms the critical function of pin support and electrical connection. The compliant area includes first and second legs spreading out to define an eye from the pin stop adjacent the wire-wrap area of the pin. Similarly, the paired legs come together at a symmetrically defined eye adjacent the connector area. In between the eyes, along the compliant portions of the leg, are formed opposing offset wedges. The opposing offset wedges are defined by a stamping process which process does not deform the sheet of material out of which the pin is made from its original planar disposition. Looking at the pin in section, paired and offset wedges are formed at an approximate 45.degree. angle to the plane of the material from which the pin is formed.

Abstract: The present invention is an improved machine for inserting a plurality of pins from a continuous webbing of pins into a motherboard. The machine has a pair of plier-like jaws with interior confronting surfaces for grasping and holding the pins when the jaws are closed. The two jaws, which extend downward, are separated from each other above the confronting surfaces to provide an opening through the jaws. The continuous webbing is fed through this opening with the pins extending down between the confronting surfaces of the jaws. When the desired number of pins are between the jaws, the jaws close to grasp the pins and the carrier strip is then separated from the pins. The jaws are then moved downward to insert the pins into the motherboard with the opening preventing interference with the carrier strip.