Abstract: A chip scale package implements solder bars to form a connection between a chip and a trace, formed in a substrate, such as another chip or PCB. Solder bars are formed by depositing one or more solder layers into the socket, or optionally, depositing a base metal layer into the socket and applying the solder layer to the base metal layer. The geometry of a solder bars may be rectangular, square, or other regular or irregular geometry. Solder bars provide a greater utilization of the connectivity footprint and increase the electrical and thermal flow capacity. Solder bars also provide a robust connection.

Abstract: A chip scale package implements solder bars to form a connection between a chip and a trace, formed in a substrate, such as another chip or PCB. Solder bars are formed by depositing one or more solder layers into the socket, or optionally, depositing a base metal layer into the socket and applying the solder layer to the base metal layer. The geometry of a solder bars may be rectangular, square, or other regular or irregular geometry. Solder bars provide a greater utilization of the connectivity footprint and increase the electrical and thermal flow capacity. Solder bars also provide a robust connection.

Abstract: A detection circuit and one or more wires or circuit traces are included in a die. The combination is used to detect mechanical failure of the substrate, e.g. silicon after singulation of the dice from the wafer. Failures may be detected at different regions or planes within the die, and the tests may be performed during operation of the packaged die and integrated circuit, even after installation and during operation of a larger electronic device in which it is incorporated. This is especially useful for chip scale packages, but may be utilized in any type of IC package.

Abstract: A chip scale package implements solder bars to form a connection between a chip and a trace, formed in a substrate, such as another chip or PCB. Solder bars are formed by depositing one or more solder layers into the socket, or optionally, depositing a base metal layer into the socket and applying the solder layer to the base metal layer. The geometry of a solder bars may be rectangular, square, or other regular or irregular geometry. Solder bars provide a greater utilization of the connectivity footprint and increase the electrical and thermal flow capacity. Solder bars also provide a robust connection.

Abstract: A detection circuit and one or more wires or circuit traces are included in a die. The combination is used to detect mechanical failure of the substrate, e.g. silicon after singulation of the dice from the wafer. Failures may be detected at different regions or planes within the die, and the tests may be performed during operation of the packaged die and integrated circuit, even after installation and during operation of a larger electronic device in which it is incorporated. This is especially useful for chip scale packages, but may be utilized in any type of IC package.

Abstract: A multi-phase, coupled-inductor, DC-DC voltage converter operates in discontinuous conduction mode (DCM) when the system is operated at low output power demand. An embodiment of the converter switches to operating in continuous conduction mode (CCM) when the system is operated at high output power demand. Operation in single-drive and rotating phase DCM operation at low power are described. An alternative embodiment operates in a multiple-drive, rotating-phase, discontinuous conduction mode during at least one condition of output power demand.

Abstract: A multi-phase, coupled-inductor, DC-DC voltage converter operates in discontinuous conduction mode (DCM) when the system is operated at low output power demand. An embodiment of the converter switches to operating in continuous conduction mode (CCM) when the system is operated at high output power demand. Operation in single-drive and rotating phase DCM operation at low power are described. An alternative embodiment operates in a multiple-drive, rotating-phase, discontinuous conduction mode during at least one condition of output power demand.

Abstract: A multi-phase, coupled-inductor, DC-DC voltage converter operates in discontinuous conduction mode (DCM) when the system is operated at low output power demand. An embodiment of the converter switches to operating in continuous conduction mode (CCM) when the system is operated at high output power demand. Operation in single-drive and rotating phase DCM operation at low power are described. An alternative embodiment operates in a multiple-drive, rotating-phase, discontinuous conduction mode during at least one condition of output power demand.

Abstract: A chip scale package implements solder bars to form a connection between a chip and a trace, formed in a substrate, such as another chip or PCB. Solder bars are formed by depositing one or more solder layers into the socket, or optionally, depositing a base metal layer into the socket and applying the solder layer to the base metal layer. The geometry of a solder bars may be rectangular, square, or other regular or irregular geometry. Solder bars provide a greater utilization of the connectivity footprint and increase the electrical and thermal flow capacity. Solder bars also provide a robust connection.

Abstract: An integrated circuit structure with a first layer that has a first conductive area and a second conductive area that is electrically isolated from the first area, and a second layer that has a third conductive area and a fourth conductive area that is electrically isolated from the third area. An edge of the first conductive area has an extended region that protrudes into the second conductive area. An edge of the fourth conductive area has an extended region that protrudes into the third conductive area. The first area is electrically coupled to the fourth area, and the second area is electrically coupled to the third area.

Abstract: A voltage regulator has an input terminal, an output terminal, a first transistor connecting the input terminal to an intermediate terminal, a second transistor connecting the intermediate terminal to ground, a controller that drives the first and second transistors to alternately couple the intermediate terminal between the input terminal and ground, and a filter disposed between the input terminal and the output terminal to provide a substantially DC voltage at the output terminal. The controller drives the two transistors with different gate voltage, and the two transistors can have different gate oxide layer thicknesses.

Abstract: A voltage regulator has an input terminal, an output terminal, a first transistor connecting the input terminal to an intermediate terminal, a second transistor connecting the intermediate terminal to ground, a controller that drives the first and second transistors to alternately couple the intermediate terminal between the input terminal and ground, and a filter disposed between the input terminal and the output terminal to provide a substantially DC voltage at the output terminal. The controller drives the two transistors with different gate voltage, and the two transistors can have different gate oxide layer thicknesses.

Abstract: A device for dispensing fluid including a pressure-operated reservoir and a dose-metering head communicating with the reservoir to permit at least partial flow of the fluid to at least one outlet opening, the head including a fixed body and a membrane which, when at rest, comes into surface contact with at least a part of the fixed body on which the membrane is tightly mounted, the outlet opening being provided on an external element, wherein tightening of the membrane, during pressure operation of the reservoir, permits a flow from the reservoir via a peripheral space delimited by the membrane and by the part of the fixed body and which forms a passage for the fluid to the outlet opening, and, in the absence of pressure on the reservoir, to permit the membrane to occupy an equilibrium position in which the membrane is in surface contact with the part of the fixed body, by the intermediary of a thin film of fluid, essentially closing off the passage for the fluid, which essentially tightens the communication

Abstract: A voltage regulator with an input terminal and an output terminal has a printed circuit board, a substrate mounted on the printed circuit board, and a first flip-chip type integrated circuit chip mounted on the substrate. The first integrated circuit chip includes a first power switch fabricated therein to alternately couple and decouple the input terminal to the output terminal. A filter is disposed to provide a substantially DC voltage at the output terminal, and a control circuit controls the power switch to maintain the DC voltage substantially constant.

Abstract: A voltage regulator has an input terminal, an output terminal, a first transistor connecting the input terminal to an intermediate terminal, a second transistor connecting the intermediate terminal to ground, a controller that drives the first and second transistors to alternately couple the intermediate terminal between the input terminal and ground, and a filter disposed between the input terminal and the output terminal to provide a substantially DC voltage at the output terminal. The controller drives the two transistors with different gate voltage, and the two transistors can have different gate oxide layer thicknesses.

Abstract: A voltage regulator with an input terminal to be coupled to an input voltage source and an output terminal to be coupled to a load. The voltage regulator has a first switch to intermittently couple the output terminal to the input terminal, a voltage sensor to detect a voltage at the output terminal, a current sensor to detect a current flowing along a circuit path between the input terminal and the output terminal, and a controller connected to the switch, the voltage sensor and the current sensor. The controller is configured to close the first switch if the voltage is less than a first threshold voltage and the current is less than a first threshold current, and the controller is configured to open the first switch if the voltage is greater than a second threshold voltage and the current is greater than a second threshold current.

Abstract: A voltage regulator with an input terminal and an output terminal has a printed circuit board, a substrate mounted on the printed circuit board, and a first flip-chip type integrated circuit chip mounted on the substrate. The first integrated circuit chip includes a first power switch fabricated therein to alternately couple and decouple the input terminal to the output terminal. A filter is disposed to provide a substantially DC voltage at the output terminal, and a control circuit controls the power switch to maintain the DC voltage substantially constant.

Abstract: A voltage regulator with an input terminal and an output terminal has a printed circuit board, a substrate mounted on the printed circuit board, and a first flip-chip type integrated circuit chip mounted on the substrate. The first integrated circuit chip includes a first power switch fabricated therein to alternately couple and decouple the input terminal to the output terminal. A filter is disposed to provide a substantially DC voltage at the output terminal, and a control circuit controls the power switch to maintain the DC voltage substantially constant.

Abstract: An electric flatiron which substantially eliminates the scorching or burning of fabric material to be ironed. The electric flatiron comprises a housing having a handle attached thereto, a metallic sole plate in electrical contact with electric leads, and spring urged glide assemblies secured to the housing and up to 2.5 centimeters or one inch adapted to extend below the lower surface of the sole plate when there is no or little pressure upon the handle of the housing but moves upwardly in alignment with the lower surface of the sole plate when pressure is placed upon the handle of the housing during the ironing process.

Abstract: An electric flatiron which substantially eliminates the scorching or burning of fabric material to be ironed. The electric flatiron comprises a housing having a handle attached thereto, a metallic sole plate in electrical contract with electric leads and including a plurality of spaced bores therein, and spring urged ball bearing glide assemblies mounted with each spaced bore in the sole plate which is adapted to extend in the order of one-eighth to one-quarter includes below the lower surface of the sole plate when there is no or little pressure upon the handle of the housing but moves upwardly beyond the lower surface of the sole plate when pressure is placed upon the handle of the housing during the ironing process.