Abstract: An anisotropic interposer pad (10) disposed between a first surface (11) and a second surface (12) in an electrical interface wherein the interface surfaces (11, 12) are non-compatible metals. The interposer pad (10) is a plastic layer (20) and a plurality of spaced-apart electrically conducting particles (21) are disposed in a random pattern throughout the plastic layer (20). The particles (21) extend between the first side (22) of the plastic layer (20) and the second side (23) of the plastic layer (20). There is no lateral contact between any of the particles (21). The particles (21) are electrically conductive in a direction oriented between the first side (22) and the second side (23) of the plastic layer (20). The particles (21) act as an electrical connection between the first surface (11) and the second surface (12).

Abstract: A circuit interface for an electrical connector having a compressible elastomeric core. The circuit traces on the elastomeric core have a roughened copper foil inner layer, an intermediate metal layer and a gold outer layer in which the intermediate layer and outer layer have asperites which correspond with and complement the roughened surface of the copper inner layer. The asperites abrade and bite through oxidized surfaces of electrical members which are contacted by the circuit traces on the elastomeric core and assure good electrical conductivity for the circuit interface.

Abstract: A method for the selective plating of a metal substrate on which a thin polymeric plating resist is first applied, followed by the selective removal of said resist to expose portions of said substrate to plating, and plating. More particularly, the method hereof includes the steps of selecting a laser wavelength which couples well to the metal substrate, choosing a polymer based plating resist having a low optical coefficient of absorption at said wavelength, curing said resist, subjecting selective areas of said resist to a single excimer laser shot, having a short wavelength, to cause ablative removal of the resist over the selective areas of said substrate, and subjecting said exposed portions of said substrate to metal plating.