Abstract: The present disclosure includes a retrofit sensor module for use with a protective head top with a helmet and a visor. The sensor module includes a sensor housing and an attachment mechanism. The sensor housing encloses a head presence sensor to sense when the protective head top is being worn. The sensor housing also encloses a position sensor to sense the position of the visor relative to the helmet. The retrofit sensor module further comprises an attachment mechanism secured to the housing. The attachment mechanism mates with a first hinge component of a hinge assembly in the protective head top to removably install the sensor module into the protective head top, wherein the hinge assembly allows the visor to move relative to the helmet.

Abstract: The present disclosure includes a retrofit sensor module for use with a protective head top with a helmet and a visor. The sensor module includes a sensor housing and an attachment mechanism. The sensor housing encloses a head presence sensor to sense when the protective head top is being worn. The sensor housing also encloses a position sensor to sense the position of the visor relative to the helmet. The retrofit sensor module further comprises an attachment mechanism secured to the housing. The attachment mechanism mates with a first hinge component of a hinge assembly in the protective head top to removably install the sensor module into the protective head top, wherein the hinge assembly allows the visor to move relative to the helmet.

Abstract: The present disclosure includes a retrofit sensor module for use with a protective head top with a helmet and a visor. The sensor module includes a sensor housing and an attachment mechanism. The sensor housing encloses a head presence sensor to sense when the protective head top is being worn. The sensor housing also encloses a position sensor to sense the position of the visor relative to the helmet. The retrofit sensor module further comprises an attachment mechanism secured to the housing. The attachment mechanism mates with a first hinge component of a hinge assembly in the protective head top to removably install the sensor module into the protective head top, wherein the hinge assembly allows the visor to move relative to the helmet.

Abstract: The present disclosure includes a retrofit sensor module for use with a protective head top with a helmet and a visor. The sensor module includes a sensor housing and an attachment mechanism. The sensor housing encloses a head presence sensor to sense when the protective head top is being worn. The sensor housing also encloses a position sensor to sense the position of the visor relative to the helmet. The retrofit sensor module further comprises an attachment mechanism secured to the housing. The attachment mechanism mates with a first hinge component of a hinge assembly in the protective head top to removably install the sensor module into the protective head top, wherein the hinge assembly allows the visor to move relative to the helmet.

Abstract: The present disclosure includes a retrofit sensor module for use with a protective head top with a helmet and a visor. The sensor module includes a sensor housing and an attachment mechanism. The sensor housing encloses a head presence sensor to sense when the protective head top is being worn. The sensor housing also encloses a position sensor to sense the position of the visor relative to the helmet. The retrofit sensor module further comprises an attachment mechanism secured to the housing. The attachment mechanism mates with a first hinge component of a hinge assembly in the protective head top to removably install the sensor module into the protective head top, wherein the hinge assembly allows the visor to move relative to the helmet.

Abstract: The present disclosure includes a retrofit sensor module for use with a protective head top with a helmet and a visor. The sensor module includes a sensor housing and an attachment mechanism. The sensor housing encloses a head presence sensor to sense when the protective head top is being worn. The sensor housing also encloses a position sensor to sense the position of the visor relative to the helmet. The retrofit sensor module further comprises an attachment mechanism secured to the housing. The attachment mechanism mates with a first hinge component of a hinge assembly in the protective head top to removably install the sensor module into the protective head top, wherein the hinge assembly allows the visor to move relative to the helmet.

Abstract: The present disclosure includes a retrofit sensor module for use with a protective head top with a helmet and a visor. The sensor module includes a sensor housing and an attachment mechanism. The sensor housing encloses a head presence sensor to sense when the protective head top is being worn. The sensor housing also encloses a position sensor to sense the position of the visor relative to the helmet. The retrofit sensor module further comprises an attachment mechanism secured to the housing. The attachment mechanism mates with a first hinge component of a hinge assembly in the protective head top to removably install the sensor module into the protective head top, wherein the hinge assembly allows the visor to move relative to the helmet.

Abstract: The present disclosure includes a retrofit sensor module for use with a protective head top with a helmet and a visor. The sensor module includes a sensor housing and an attachment mechanism. The sensor housing encloses a head presence sensor to sense when the protective head top is being worn. The sensor housing also encloses a position sensor to sense the position of the visor relative to the helmet. The retrofit sensor module further comprises an attachment mechanism secured to the housing. The attachment mechanism mates with a first hinge component of a hinge assembly in the protective head top to removably install the sensor module into the protective head top, wherein the hinge assembly allows the visor to move relative to the helmet.

Abstract: A preamplifier chip for a disk drive is modular in layout. Twelve head cells for the preamplifier chip are not lined along the periphery of the chip, but rather are disposed in an array including four rows of three head cells each. The rows are all directed perpendicular to the side with control connection pads. The preferred embodiment allows for a smaller preamplifier chip through increasing the density of head cells on the chip relative to the periphery of the chip usable for head cell connection. The array spaces write portions of the head cells in four spaced lines, minimizing problems associated with heat build up. Spacing between rows of the array can be determined to take maximum advantage of lead pitch on the flex circuit. Modification of the design to a chip for eight or four channels is possible with minimal changes to the design, and minimal reworking of the common circuitry.