Patents by Inventor Charles Packer

Charles Packer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160248864
    Abstract: The present subject matter relates to systems and methods for providing enhanced social networking, or other games, that include various profile unlocking techniques and/or bi-directional profile matching. In some examples, a game-like experience may be provided in which an “unveiling” or “unraveling” mechanic is used, e.g. to clarify or unlock one or more blurred user-uploaded photos, or other user-related information, in a mobile social networking, or other, application. In some examples, a game-like experience may be provided in which profile unveiling mechanics are used with a virtual currency in a mobile social networking, or other, application. A questionnaire-based bi-directional profile matchmaking and recommendation algorithm may also be provided for use in a mobile social networking, or other, application.
    Type: Application
    Filed: November 19, 2015
    Publication date: August 25, 2016
    Applicant: UNRAVEL, LLC
    Inventors: Jason LOIA, Kenny YAN, Charles PACKER, Wayne TOW, Aisha THIESSEN, Gary SCHOFIELD
  • Patent number: 8167189
    Abstract: Methods for reworking a solder containing one or more joined members are described herein. Such methods can include applying a disintegrating agent to a solder containing a solder material, disintegrating the solder material to form a disintegrated solder material, and removing the disintegrated solder material from the solder. Such methods can also include applying a disintegrating agent containing bismuth to a solder containing a solder material, and heating the solder to liquefy the disintegrating agent. Such methods can also include applying a disintegrating agent containing a bismuth alloy to a solder having a solder material that contains metal nanoparticles, and heating the solder to liquefy the bismuth alloy.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: May 1, 2012
    Assignee: Lockheed Martin Corporation
    Inventors: Alfred A. Zinn, Charles Packer, Frances Chiu, Earl Montgomery
  • Publication number: 20110240716
    Abstract: Methods for reworking a solder containing one or more joined members are described herein. Such methods can include applying a disintegrating agent to a solder containing a solder material, disintegrating the solder material to form a disintegrated solder material, and removing the disintegrated solder material from the solder. Such methods can also include applying a disintegrating agent containing bismuth to a solder containing a solder material, and heating the solder to liquefy the disintegrating agent. Such methods can also include applying a disintegrating agent containing a bismuth alloy to a solder having a solder material that contains metal nanoparticles, and heating the solder to liquefy the bismuth alloy.
    Type: Application
    Filed: March 28, 2011
    Publication date: October 6, 2011
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventors: Alfred A. ZINN, Charles Packer, Frances Chiu, Earl Montgomery