Abstract: A mask structure and photolithographic method using the same for obtaining shorter and thinner line or feature lengths for optimizing power consumption and performance in semiconductor devices. According to a first aspect, a method for enabling trimming of semiconductor linewidth dimensions implements an extra dose trim mask. The lithographic method using the extra dose trim mask to make small adjustments to patterned linewidth exposures for enhanced CD control may be used to trim or adjust whole or a plurality of regions of a lithographic exposure. There is additionally provided a structure and method of creating a lithographic dual exposure mask having one or more regions comprising one or more partial energy absorptive layers such that, when subject to a blanket dose, enable smaller image size adjustments in those regions.

Abstract: An improved method for applying an annular tread (10) to a pneumatic tire casing (20) which has the steps of mounting the tread (10) on a tread expander assembly (200) wherein the tread (10) pass over a mount wheel (300) prior to the casing (20) being mounted onto the mount wheel. The improved apparatus (100) has all the mechanisms for supporting the casing (20) and the tread (10) extended from one end (405) allowing the operator to work entirely in front of the apparatus.

Abstract: An improved method for applying an annular tread (10) to a pneumatic tire casing (20) which has the steps of mounting the tread (10) on a tread expander assembly (200) wherein the tread (10) pass over a mount wheel (300) prior to the casing (20) being mounted onto the mount wheel. The improved apparatus (100) has all the mechanisms for supporting the casing (20) and the tread (10) extended from one end (405) allowing the operator to work entirely in front of the apparatus.

Abstract: An undertread measuring apparatus which includes a lift cylinder for rasing and lowering a sensor support assembly. The support assembly is attached to a support rod by two collars so that the assembly can rotate away upon impact and will automatically realign itself. The assembly is lowered by the lift cylinder at an angle from the vertical so that first one sensor comes into contact with the tire and then the other. The support assembly has two rollers offset from each other so that the sensor head will locate itself at the correct distance from the tire.