Abstract: A vehicle weight classification system determines the weight of a seat occupant for controlling airbag deployment. Strain gauge sensors preferably provide signals having a magnitude that is indicative of the weight of the seat occupant. A converting module converts the sensor signals into timing information. A microprocessor, which includes a timer module, receives the timing information and makes a weight determination from the timing information.

Abstract: A vehicle weight classification system recognizes the various factors that influence system performance. Some of the factors are compensated for using analog signal processing circuitry or techniques. Other factors are compensated for using digital signal processing techniques. The unique combination of analog and digital approaches, rather than pure analog or pure digital, provides an effective solution at addressing the various factors that influence signals and system performance in a vehicle weight classification system while keeping the cost and complexity of the system within acceptable limits.

Abstract: A vehicle air intake system includes a noise cancellation assembly. A cooling member is provided at least partially within an air passageway for dissipating heat within an electronics module portion of the noise cancellation assembly. The cooling member preferably is a brass material insert that is supported at least partially within an air passageway by a housing that supports components of the noise cancellation assembly. A connecting member that thermally couples the electronics module to the cooling member also operates to secure the electronics module to the housing in one example embodiment.

Abstract: A system for controlling air bag deployment in vehicles includes the capability of accommodating varying inductants values in the air bag circuit. Wire harnesses that couple air bag components have varying characteristics, such as length, which affect the inductants value of the circuit. The inventive arrangement utilizes charge and discharge times of at least one capacitor for measuring the inductants of a particular circuit. The system includes a controller that accommodates the inductants by introducing an appropriate delay in the firing circuit signal to operate the air bag.

Abstract: A vehicle occupant sensing system includes a laser array that generates three beams. A first beam is directed toward an upper body zone, a second beam is directed toward a middle body zone, and a third beam is directed toward a lower body zone. A first sensor assembly receives reflection beams from the upper body zone and generates a first signal that represents a proportional amount of an occupant present in the upper body zone. A second sensor assembly receives reflection beams from the middle body zone and generates a second signal that represents a proportional amount of the occupant present in the middle body zone. A third sensor assembly receives reflection beams from the lower body zone and generates a third signal that represents a proportional amount of the occupant present in the lower body zone. The laser array and the first, second, and third sensor assemblies are all mounted within a common housing that is mounted to a vehicle structure such as an A-pillar or rear view mirror.

Abstract: A switched capacitor circuit for delivering electrical triggering energy to an airbag squib of a supplemental restraint system for a vehicle, or a plurality of such airbag squibs, employs a switching arrangement on both sides of the airbag squib. An energy storage element, which may be a capacitor having stored therein a quantum of energy sufficient to fire the airbag squibs is coupled thereto by a substantially series pair of electronic switches connecting each terminal of the storage capacitor to each terminal of the airbag squib arrangement. A further capacitor is coupled across the airbag squib arrangement, electrically intermediate of the substantially series pairs of electronic switches. A still further capacitor is coupled across the airbag squib arrangement itself. This arrangement can withstand plural short-circuit false conditions, including short-circuits to ground or to supply potential at the terminals of the airbag squib arrangement itself.

Abstract: A control arrangement for a deployable airbag of a vehicle is provided with first and second airbag controllers for receiving a fault signal at the first airbag controller, and for producing at the second airbag controller a deployment command signal that indicates that the deployable airbag is to be deployed. The second airbag controller receives the deployment command signal, and is provided with a communication controller for receiving the deployment command signal, a squib for firing in response to the deployment command signal whereby the deployable airbag is deployed, and an energy transfer arrangement coupled to the communication controller and the squib for transferring a deployment energy to the squib in response to the deployment command signal. The squib is configured to require a predeterminable minimum quantum of energy to effect the firing thereof in response to the deployment command signal.

Abstract: A control arrangement for a deployable airbag of a vehicle is provided with a squib for firing in response to a deployment command signal whereby the deployable airbag is deployed. Bilateral communication is effected between the control arrangement and an airbag electronic controller. Electrical energy and data, including the deployment command signal are conveyed to the control arrangement, and at least self-diagnosis information is conveyed to the airbag electronic controller. The squib is configured to require a predeterminable minimum quantum of energy to effect the firing thereof in response to the deployment command signal. A heater provides a radiated preheat to the squib, whereby the predeterminable minimum quantum of energy applied to effect firing of the squib is exceeded by a combination of the first electrical energy and the radiated preheat energy. The squib and the preheater preferably are both formed on a silicon substrate using a conventional integration process.

Abstract: The electronics are self-contained within the fuel rail assembly and include a microprocessor-based arrangement for enabling the fuel rail assembly to be dynamically calibrated over its full operating range at the factory and to be subsequently operated by serial data transmitted to it from the engine management computer.

Abstract: Two discrete self-heating elements are provided in a silicon based sensor structure. The first, "transfer" self-heating element receives constant current and elevates the temperature of the sensor structure to a desired initial temperature above ambient. The second, "sensor" self-heating element is thermally coupled to the first element and receives a current adjusted based on the difference between ambient temperature and the sensor structure temperature so as to maintain a constant temperature difference. Most of the current flowing through the sensor heating element is thus attributable to fluid flow, and this current can therefore be conveniently used to determine fluid flow parameters (e.g., mass air flow). The elements may comprise thin films which may be interlaced or stacked vertically.

Abstract: A matrix consisting of glass microspheres and cured epoxy is disposed in a cavity at the backside of the silicon diaphragm to strengthen the diaphragm without any significant adverse influence on the ability of the sensor to quickly and accurately respond to changes in mass air flow. The strenthening which is imparted to the device enables it to comply with certain specifications defining the extent to which the device must be capable of withstanding damage from air-entrained dust particles acting on the frontside of the diaphragm.

Abstract: A mass airflow sensor is disclosed which uses a small, thin dielectric diaphragm providing good thermal isolation for thin-film heating and temperature sensing elements, resulting in high flow sensitivity and low current operation of the heating element. The dielectric diaphragm is bounded by a p-etch-stopped silicon rim. The mass airflow sensor includes a primary sensor circuit which maintains a heated primary temperature sensing element and an ambient air temperature sensing element at a constant temperature difference. A slave sensor circuit, which includes a plurality temperature sensing elements, monitors heat loss due to airflow at a particular location on the diaphragm and generates an output signal indicative of airflow which is independent of ambient air temperature.

Abstract: This relates to the scribing and breaking of a semiconductor wafer into individual dies by anodizing the silicon in regions corresponding to the die boundaries. The regions are selectively anodized, and the anodization is continued until the anodized silicon extends into the semiconductor wafer to a depth that allows easy breakage when the wafer is stressed. To facilitate breakage, the anodized silicon may be removed with hydrofluoric acid.

Abstract: An integrated circuit having dielectric isolation is fabricated by growing a double epitaxial layer of N-type semiconductive material onto a P-type substrate. A dielectric layer is formed over the epitaxial layer and thereafter the dielectric and the epitaxial growth are removed in selected isolation regions to expose the substrate. A metal layer is evaporated onto the device so that metal is deposited both on the exposed substrate material and on the dielectric layer. A dielectric is formed by selectively anodizing the metal deposited on the exposed substrate to provide electrical isolation between the remaining portions of the epitaxial growth. Because of the electrical insulating characteristics of the dielectric layer, the metal deposited on the dielectric layer is not anodized and may be removed using a compound that attacks the unanodized metal and has little effect on the anodized metal. Base and emitter elements are formed in the conventional manner to complete the integrated circuit.

Abstract: An integrated circuit having dielectric isolation is fabricated by growing a double epitaxial layer of N-type semiconductive material onto a P-type substrate. A dielectric layer is formed over the epitaxial layer and thereafter the dielectric and a portion of the epitaxial growth are removed in selected isolation regions to expose the semiconductive material. A dielectric is formed by anodizing the N-type semiconductive material in the selected isolation regions to provide electrical isolation between the remaining portions of the epitaxial growth. Base and emitter elements are formed in the conventional manner to complete the integrated circuit which is thereafter packaged.

Abstract: A self-aligning integrated circuit package includes an integrated circuit die having raised contact pads mounted to an interconnecting die in flip chip fashion. The interconnecting die is formed of anodizable material and has raised anodized portions that form guide means for aligning the integrated circuit die and the leads of a lead frame so that they are positioned over conductive portions of the interconnecting die which connect the contact pads of the integrated circuit to the leads of the lead frame.

Abstract: An integrated circuit having dielectric isolation is fabricated by growing a double epitaxial layer of N-type semiconductive material onto a P-type substrate. A dielectric layer is formed over the epitaxial layer and thereafter the dielectric and the epitaxial growth are removed in selected isolation regions to expose the substrate. A metal layer is evaporated onto the device so that metal is deposited both on the exposed substrate material and on the dielectric layer. A dielectric is formed by selectively anodizing the metal deposited on the exposed substrate to provide electrical isolation between the remaining portions of the epitaxial growth. Because of the electrical insulating characteristics of the dielectric layer, the metal deposited on the dielectric layer is not anodized and may be removed using a compound that attacks the unanodized metal and has little effect on the anodized metal. Base and emitter elements are formed in the conventional manner to complete the integrated circuit.