Patents by Inventor Charles R Keil
Charles R Keil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6971429Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board.Type: GrantFiled: December 11, 2002Date of Patent: December 6, 2005Assignee: Shipley Company, L.L.C.Inventors: Charles R Keil, Osvaldo Novello, Roberto Stanich
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Patent number: 6679307Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under heat, vacuum and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (136) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained.Type: GrantFiled: July 3, 2002Date of Patent: January 20, 2004Assignee: Shipley Company, L.L.C.Inventors: Charles R. Keil, Osvaldo Novello
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Publication number: 20030162123Abstract: A functionalized polymer containing a main chain derived from polyerizable monomers and pendent functional groups derived from isocyanates terminated with &agr; or &bgr; ethylenically or acetyenically unsaturated groups. The functionalized polymer forms a good film and may be employed in industries where film forming polymers are used. Such industries include lithography, adhesives, electrophotoimaging, and the like. The functionalized polymers are self cross-linking and are suitable for use as polymer binders in both primary and secondary photoimaging compositions.Type: ApplicationFiled: February 15, 2003Publication date: August 28, 2003Applicant: Shipley Company, L.L.C.Inventors: Robert K. Barr, Charles R. Keil, Steven M. Luboviski
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Patent number: 6610459Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board.Type: GrantFiled: August 25, 2000Date of Patent: August 26, 2003Assignee: Shipley Company, L.L.C.Inventors: Charles R. Keil, Osvaldo Novello, Roberto Stanich
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Publication number: 20030121604Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board.Type: ApplicationFiled: December 11, 2002Publication date: July 3, 2003Applicant: Shipley Company, L.L.C.Inventors: Charles R. Keil, Osvaldo Novello, Roberto Stanich
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Patent number: 6585837Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under heat, vacuum and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (136) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained.Type: GrantFiled: August 25, 2000Date of Patent: July 1, 2003Assignee: Shipley Company, L.L.C.Inventors: Charles R. Keil, Osvaldo Novello
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Publication number: 20030051790Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under heat, vacuum and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (136) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained.Type: ApplicationFiled: July 3, 2002Publication date: March 20, 2003Applicant: Shipley Company, L.L.C.Inventors: Charles R. Keil, Osvaldo Novello
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Patent number: 5773518Abstract: A binder polymer is a styrene/maleic anhydride copolymer in which the maleic anhydride residues are mono-esterified to between about 50 and about 65 mole percent of an alkyl, aryl, cycloalkyl, alkaryl, or arylalkyl alcohol having a molecular weight greater than 100, to between about 15 and about 50 mole percent of a C.sub.1 -C.sub.3 -alkyl alcohol, and to at least about 80 mole percent total. The polymer has between about 45 and about 65 mole percent styrene residues and between about 35 and about 55 mole percent maleic anhydride residues, a weight average molecular weight of between about 80,000 and about 200,000, and an acid number of between about 170 and about 220.Type: GrantFiled: August 15, 1997Date of Patent: June 30, 1998Assignee: Morton International, Inc.Inventors: Charles R. Keil, Randall William Kautz
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Patent number: 5698376Abstract: In a method of providing a resist pattern on a substrate surface, a layer of photoimageable composition is applied to a substrate, which photoimageable composition provides a tack-free surface. The photoimageable composition comprises:A) between about 25 and about 75 wt % of a binder polymer, B) between about 20 and about 60 wt % of a photopolymerizeable material which is a multifunctional photopolymerizeable monomer or short chain oligomer, and C) between about 2 and about 20 wt % of a photoinitiator chemical system (the weight percentages are based on the total weight of components A)-C)). The binder polymer A) comprises a backbone formed of between about 45 and about 65 mole percent of monomers which are selected from the group i) consisting of styrene, C.sub.1 14 C.sub.Type: GrantFiled: March 20, 1996Date of Patent: December 16, 1997Assignee: Morton International, Inc.Inventors: James J. Briguglio, Charles R. Keil, Vinai Ming Tara, Edward J. Reardon, Jr., Randall W. Kautz
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Patent number: 5698370Abstract: A photoimageable composition, useful as a photoresist for forming a printed circuit board, is both alkaline aqueous developable but, subsequent to exposure and development, is processable in highly alkaline environments, such as additive plating baths and ammoniacal etchants. The photoimageable composition comprises A) between about 25 and about 75 wt % of a binder polymer, B) between about 20 and about 60 wt % of a photopolymerizeable material which is a multifunctional photopolymerizeable monomer or short chain oligomer, and C) between about 2 and about 20 wt % of a photoinitiator chemical system, the weight percentages being based on the total weight of components A)-C).Type: GrantFiled: September 6, 1996Date of Patent: December 16, 1997Assignee: Morton International, Inc.Inventors: Charles R. Keil, Randall William Kautz
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Patent number: 5609991Abstract: A photoimageable composition, useful as a photoresist for forming a printed circuit board, is both alkaline aqueous developable but, subsequent to exposure and development, is processable in highly alkaline environments, such as additive plating baths and ammoniacal etchants. The photoimageable composition is tack-free and is resistance to polymerization inhibition by oxygen, and is therefore particularly suitable for contact printing. The photoimageable composition comprises A) between about 25 and about 75 wt % of a binder polymer, B) between about 20 and about 60 wt % of a photopolymerizeable material which is a multifunctional photopolymerizeable monomer or short chain oligomer, and C) between about 2 and about 20 wt % of a photoimageable chemical system, the weight percentages being based on the total weight of components A)-C).Type: GrantFiled: August 3, 1995Date of Patent: March 11, 1997Assignee: Morton International, Inc.Inventors: James J. Briguglio, Charles R. Keil, Vinai M. Tara, Edward J. Reardon, Jr., Randall W. Kautz
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Patent number: 5576145Abstract: A photoimageable composition, useful as a photoresist for forming a printed circuit board, is both alkaline aqueous developable but, subsequent to exposure and development, is processable in highly alkaline environments, such as additive plating baths and ammoniacal etchants. The photoimageable composition comprises A) between about 25 and about 75 wt % of a binder polymer, B) between about 20 and about 60 wt % of a photopolymerizeable material which is a multifunctional photopolymerizeable monomer or short chain oligomer, and C) between about 2 and about 20 wt % of a photoinitiator chemical system, the weight percentages being based on the total weight of components A)-C).Type: GrantFiled: February 10, 1995Date of Patent: November 19, 1996Assignee: Morton International, Inc.Inventors: Charles R. Keil, Randall W. Kautz