Abstract: The present invention relates to a workpiece placement system for picking and placing a workpiece on a product being assembled. The workpiece placement system includes a mechanical housing having a telescopic arm that is extendable between a retracted position and an extended position. A vacuum source providing a vacuum pressure below ambient conditions is in fluid communication with a vacuum conduit along the telescopic arm. The telescopic arm includes at least one opening at its distal end that allows the vacuum pressure to suck and hold the workpiece in place on the telescopic arm. The workpiece is securely held in place on the telescopic arm as it is extended from the initial retracted position to the extended position. After the telescopic arm is fully extended the workpiece is positioned proximate the product being assembled, and the vacuum is interrupted to release the workpiece.