Abstract: A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

Abstract: A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Abstract: The invention provides multilayer circuit boards and methods for formation of a sequential build circuit board. Among other things, glass fiber reinforced copper clad epoxy substrates, required to provide strength or rigidity to prior boards, are not required for preferred circuit boards of the invention.

Abstract: A method for manufacture of a circuit method board which comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Abstract: A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The compositions of the invention are use to form flexible coatings having a dielectric constant of 3 or less. The compositions comprise a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspect of the invention, the compositions of the invention further comprise a crosslinking agent capable of solvating the remaining constituents of the composition. The coatings are used for the manufacture of electronic and other devices.

Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.

Abstract: A color filter assembly comprising a topcoat layer which comprises a composition, wherein the composition in general comprises a crosslinking agent and a reactive resin binder, i.e., a resin that can undergo self-condensation and/or crosslinking with one or more other components of the composition upon thermal treatment or other activation. Preferred resin binders include those resins that contain pendant polar functional groups, particularly acidic moieties such as carboxyl (COOH) and/or hydroxyl (OH). Acrylic resins containing such groups are particularly preferred. Compositions of the invention exhibit low thickness loss and have exceptional light transmission properties. Compositions of the invention are also useful as carriers for pigments and dyes for forming color filter elements.

Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.

Abstract: The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.

Abstract: Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.

Abstract: The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques.

Abstract: The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and photoimaging of permanent dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using photoimaging techniques.

Abstract: This invention is for a photoresist capable of withstanding temperatures in excess of 200.degree. C. without image distortion. The photoresist comprises a high temperature diazo sensitizer, preferably an ester or amide of an o-quinone diazide sulfonic or carboxylic acid chloride, in a binder comprising a polyvinyl phenol. The sensitizer and polyvinyl phenol react with each other at elevated temperature. The sensitizer has a secondary decomposition temperature and the polyvinyl phenol has a flow temperature at least equal to the temperature where reaction between the two occurs.

Abstract: This invention relates to electroless metal deposition and more specifically, to a process where a plating solution is brought to equilibrium and thereafter operated with the concentration of plating reactants and by-products maintained substantially constant. The plating solution treated in accordance with the invention is one having evaporative losses of at least one percent per plating cycle. Following the process, a plating solution can be operated indefinitely and yields a metal plate of uniform quality and predictable properties at any time during use of the solution. The invention avoids the known problems of by-product build-up and variable concentration of reactants typically associated with the use of such solutions.