Abstract: Embodiments are directed towards a lift system for extracting a fluid from a well. The system may include a production tube and at least one bladder located inside a pump barrel which is connected to the production tube. The bladder may include a top connector configured to receive a concentric tubing. The lift system may further include a compression system connected to the concentric tubing. The compression system may be configured to provide a compressed gas through the concentric tubing to the at least one bladder.

Abstract: A micro compliant, test probe interconnect apparatus for an integrated circuit device is disclosed. In an exemplary embodiment, the apparatus includes an elongated housing and a probe pin extending from a first end of the housing. A biasing mechanism holds the probe pin in a normally extended position, wherein the biasing mechanism is formed from a portion of the elongated housing. In a preferred embodiment, the biasing mechanism is a flexible tab, formed from a generally rectangular section of the elongated housing and bent inwardly therein to form a cantilever.

Abstract: A micro compliant, test probe interconnect apparatus for an integrated circuit device is disclosed. In an exemplary embodiment, the apparatus includes an elongated housing and a probe pin extending from a first end of the housing. A biasing mechanism holds the probe pin in a normally extended position, wherein the biasing mechanism is formed from a portion of the elongated housing. In a preferred embodiment, the biasing mechanism is a flexible tab, formed from a generally rectangular section of the elongated housing and bent inwardly therein to form a cantilever.

Abstract: A vacuum holding chuck is presented. The vacuum holding chuck of the present invention is particularly well suited for holding semiconductor wafers of multiple diameters during various testing and manufacturing operations. In an exemplary embodiment, the vacuum chuck comprises a body having a first surface and an opposing second surface, wherein the first surface includes first and second recessed circular platforms to receive wafers having first and second diameters, respectively. The second surface includes at least one recessed circular platform to receive a wafer having a third diameter. Each circular platform is defined at least in part by an annular shoulder and each circular platform further includes a vacuum trough which is connected to a vacuum source which when activated, evacuates the air from the vacuum trough and securely holds a wafer in place within the circular platform.

Abstract: A universal mapping tool and method for mapping workpieces, such as semiconductor devices, is disclosed and described. The tool comprises a fixed and a movable gripping means adapted to mount a wide range of workpieces, means for optically locating the physical center of the workpiece fiducials mounted on the gripping means, and means for interpreting and storing the data obtained in the mapping operation.

Abstract: Apparatus for isolating a formation, isolating a damaged section of casing, and for pressure testing the apparatus when located in a cased well bore. The apparatus includes a first packer that is in sealing engagement with the casing for isolating the formation, second and third packers that are spaced to span the damage to the casing, a first valve for closing the passageway through the packers, and a second valve for applying pressure between the first and second packers to test the seals formed thereby. Also provided is an improved method for isolating a damaged section of casing, isolating a formation, and pressure testing the apparatus when located in a cased well bore. The method includes extending the aforementioned apparatus into the well bore, closing the first valve to close the flow through the packers, opening a second valve, and applying pressure to test the seals of the first and second packers.