Abstract: A micro compliant, test probe interconnect apparatus for an integrated circuit device is disclosed. In an exemplary embodiment, the apparatus includes an elongated housing and a probe pin extending from a first end of the housing. A biasing mechanism holds the probe pin in a normally extended position, wherein the biasing mechanism is formed from a portion of the elongated housing. In a preferred embodiment, the biasing mechanism is a flexible tab, formed from a generally rectangular section of the elongated housing and bent inwardly therein to form a cantilever.

Abstract: A vacuum holding chuck is presented. The vacuum holding chuck of the present invention is particularly well suited for holding semiconductor wafers of multiple diameters during various testing and manufacturing operations. In an exemplary embodiment, the vacuum chuck comprises a body having a first surface and an opposing second surface, wherein the first surface includes first and second recessed circular platforms to receive wafers having first and second diameters, respectively. The second surface includes at least one recessed circular platform to receive a wafer having a third diameter. Each circular platform is defined at least in part by an annular shoulder and each circular platform further includes a vacuum trough which is connected to a vacuum source which when activated, evacuates the air from the vacuum trough and securely holds a wafer in place within the circular platform.

Abstract: A universal mapping tool and method for mapping workpieces, such as semiconductor devices, is disclosed and described. The tool comprises a fixed and a movable gripping means adapted to mount a wide range of workpieces, means for optically locating the physical center of the workpiece fiducials mounted on the gripping means, and means for interpreting and storing the data obtained in the mapping operation.