Abstract: A method of manufacturing an electronic module includes providing a conductive strip and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a layered structure having a conductive layer defined by the conductive strip and a dielectric layer defined by the dielectric material. The method includes applying a carrier strip to the layered structure. The method includes processing the conductive layer to form a circuit while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate.

Abstract: A robotic gripper mechanism has a housing, a gripper arm and a retention projection. The gripper arm extends from the housing. The gripper arm has a gripper finger provided at a distal end thereof. The retention projection is provided on the housing and cooperates with the gripper arm to exert a retention force on the gripper arm. Wherein when an external force is applied to the gripper finger in a direction which is parallel to a longitudinal axis of the housing, the gripper arm will move relative to the housing if the external force is greater than the retention force.

Abstract: A gripper mechanism for use with a robotic positioning system. The gripper mechanism includes a housing, a gripper arm and a retention projection. The gripper arm extends from the housing. The gripper arm has a gripper finger provided at a distal end thereof The retention projection is provided on the housing and cooperates with the gripper arm to exert a retention force on the gripper arm. Wherein when an external force is applied to the gripper finger in a direction which is parallel to a longitudinal axis of the housing, the gripper arm will move relative to the housing if the external force is greater than the retention force.

Abstract: A gripper section for use with a clamp arm for use with automated machinery. The gripper section includes a plurality of beam members which extend from a base, with each beam member of the plurality of beam members having a fixed end and a free end. The gripper section also includes a plurality of gripper surfaces proximate to the free ends, with each gripper surface attached to a respective beam member of the plurality of beam member. Each gripper surface of the plurality of gripper surfaces and its respective beam member move independently of the other plurality of gripper surfaces and plurality of beam members. Wherein the plurality of gripper surfaces and the plurality of beam members conform to the shape of an object/part to be manipulated by the gripper section.

Abstract: An electronic device includes a dielectric substrate having a first surface, a conductive circuit deposited on the first surface and having a printed conductive ink trace on the first surface, and a conductive interposer mechanically coupled to the substrate. The conductive interposer is electrically coupled to the conductive circuit. The conductive interposer has a separable contact interface configured to be mechanically and electrically connected to a removable contact. Optionally, the conductive interposer may include a main body and a flexible element extending between the main body and the conductive circuit. The flexible element electrically connects the conductive circuit with the main body.

Abstract: An electronic device includes a dielectric substrate having a first surface, a conductive circuit deposited on the first surface and having a printed conductive ink trace on the first surface, and a conductive interposer mechanically coupled to the substrate. The conductive interposer is electrically coupled to the conductive circuit. The conductive interposer has a separable contact interface configured to be mechanically and electrically connected to a removable contact. Optionally, the conductive interposer may include a main body and a flexible element extending between the main body and the conductive circuit. The flexible element electrically connects the conductive circuit with the main body.

Abstract: A method of manufacturing a circuit board includes providing a metal substrate and applying a dielectric layer to the metal substrate and sacrificial bumps on the dielectric layer. The method also includes printing a conductive seed layer on the dielectric layer and the sacrificial bumps and plating a conductive circuit layer onto the conductive seed layer.

Abstract: A metal clad circuit board includes a metal substrate. A dielectric layer is applied to the metal substrate. A conductive seed layer is printed on the dielectric layer. A conductive circuit layer is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask may be applied over the conductive circuit layer.

Abstract: A crimp assembly for a terminal crimping machine that crimps a terminal to a wire includes a crimper frame having opposed ends and a longitudinal axis extending between the opposed ends. The crimper frame has a jaw mount chamber therein being open at one of the ends of the crimper frame. The crimper tame has abutment surfaces defining portions of the jaw mount chamber. Crimp tooling is held within the jaw mount chamber. The crimp tooling has terminal engagement surfaces configured to engage the terminal to form a wire crimp during a crimping process. The crimp tooling has outer surfaces, wherein the abutment surfaces of the crimper frame engage the outer surfaces of the crimp tooling during the crimp process to move the crimp tooling in a first direction generally along the longitudinal axis and in a second direction transverse to the first direction. Optionally, the crimp tooling may constitute split-jaw crimp fooling having a pair of crimper jaws movable with respect to one another.

Abstract: A printed circuit board includes a substrate having a first surface, a first conductive circuit deposited on the first surface and a dielectric cover deposited on the first surface and covering at least a portion of the first conductive circuit. The dielectric cover has an edge and the first surface is exposed beyond the edge. A second conductive circuit is deposited on the dielectric cover and the substrate. The second conductive circuit spans the edge such that at least part of the second conductive circuit is deposited on the dielectric cover and at least part of the second conductive circuit is deposited on the first surface.

Abstract: A method of manufacturing an electronic module includes providing a conductive strip and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a layered structure having a conductive layer defined by the conductive strip and a dielectric layer defined by the dielectric material. The method includes applying a carrier strip to the layered structure. The method includes processing the conductive layer to form a circuit while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate.

Abstract: A metal clad circuit board includes a metal substrate. A dielectric layer is applied to the metal substrate. A conductive seed layer is printed on the dielectric layer. A conductive circuit layer is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask may be applied over the conductive circuit layer.

Abstract: A circuit board includes a dielectric layer and sacrificial bumps on the dielectric layer in predetermined circuit common areas. A conductive seed layer is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer. Sections of the conductive circuit layer and the conductive seed layer in the circuit common areas are removed. Optionally, the circuit board may include a metal substrate, with the dielectric layer applied on the metal substrate.

Abstract: A receptacle assembly includes a housing having a front mating face and receptacles configured to receive plugs therein through the front mating face, where the plugs have connectivity pins attached thereto. The receptacle module includes connectivity sensor areas associated with the receptacles, where each connectivity sensor area is positioned adjacent the corresponding receptacle. Each connectivity sensor area has a first connectivity sensor and a second connectivity sensor that is electrically isolated from the first connectivity sensor when the plug is disconnected from the receptacle. Both the first and second connectivity sensors are configured to be engaged by different connectivity pins of the plug when the plug is received in the corresponding receptacle to form a sense circuit.

Abstract: A plug assembly includes a body extending between a mating end and a cable end. A sensor assembly is supported by the body that has an integrated circuit component having a first pad and a second pad. The sensor assembly also has a first sensor probe mounted to the first pad and a second sensor probe mounted to the second pad.

Abstract: A crimp assembly for a terminal crimping; machine that crimps a terminal to a wire includes a crimper frame having opposed ends and a longitudinal axis extending between the opposed ends. The crimper frame has a jaw mount chamber therein being open at one of the ends of the crimper frame. The crimper tame has abutment surfaces defining portions of the jaw mount chamber. Crimp tooling is held within the jaw mount chamber. The crimp tooling has terminal engagement surfaces configured to engage the terminal to form a wire crimp during a crimping process. The crimp tooling has outer surfaces, wherein the abutment surfaces of the crimper frame engage the outer surfaces of the crimp tooling during the crimp process to move the crimp tooling in a first direction generally along the longitudinal axis and in a second direction transverse to the first direction. Optionally, the crimp tooling may constitute split-jaw crimp fooling having a pair of crimper jaws movable with respect to one another.

Abstract: A composite electrical connector assembly includes a housing, a shield, and an electrical contact. The housing is formed from a first material and has an interior chamber. The interior chamber includes a stepped cylindrical surface with first and second openings at mating and mounting ends of the housing, respectively. The interior chamber is staged in diameter to form front, intermediate and rear stages. The shield is formed from a second material and is shaped to fit within the interior chamber. The shield engages the rear stage of the interior chamber and is prevented from being removed from the second opening by the rear stage. The electrical contact is disposed within the interior chamber, is aligned along a longitudinal axis of the connector assembly and is configured to receive a center conductor of a cable and to connect with a conductor of a communication device.

Abstract: A light emitting assembly, and wirelessly controlled light emitting assembly for use in a lighted display having a housing body configured to receive a light emitting device having a plurality of wirelessly controlled light emitting elements. The housing body includes at least one mounting feature arranged and disposed to maintain a relative positioning of the light emitting assembly with respect to another light emitting assembly.

Abstract: A composite electrical connector assembly includes a housing, a shield, and an electrical contact. The housing is formed from a first material and has an interior chamber. The interior chamber includes a stepped cylindrical surface with first and second openings at mating and mounting ends of the housing, respectively. The interior chamber is staged in diameter to form front, intermediate and rear stages. The shield is formed from a second material and is shaped to fit within the interior chamber. The shield engages the rear stage of the interior chamber and is prevented from being removed from the second opening by the rear stage. The electrical contact is disposed within the interior chamber, is aligned along a longitudinal axis of the connector assembly and is configured to receive a center conductor of a cable and to connect with a conductor of a communication device.

Abstract: A laminated electrical contact strip includes a plurality of electrical contacts. Each electrical contact includes a pair of opposite first and second surfaces extending between a pair of opposite end portions. A pair of first and second dielectric layers are laminated over the plurality of electrical contacts such that the first and second dielectric layers hold the plurality of electrical contacts therebetween. The first dielectric layer is bonded to and covers a portion of the first surface of each of the electrical contacts. The second dielectric layer is bonded to and covers a portion of the second surface of each of the electrical contacts.