Abstract: Disclosed herein is a composite comprising a metal alloy matrix; where the metal alloy matrix comprises aluminum in an amount greater than 50 atomic percent; a first metal and a second metal; where the first metal is different from the second metal; and where the metal alloy matrix comprises a low temperature melting phase and a high temperature melting phase; where the low temperature melting phase melts at a temperature that is lower than the high temperature melting phase; and a contracting constituent; where the contracting constituent exerts a compressive force on the metal alloy matrix at a temperature between a melting point of the low temperature melting phase and a melting point of the high temperature melting phase or below the melting points of the high and low temperature melting phases.

Abstract: Disclosed herein is a composite comprising a metal alloy matrix; where the metal alloy matrix comprises aluminum in an amount greater than 50 atomic percent; a first metal and a second metal; where the first metal is different from the second metal; and where the metal alloy matrix comprises a low temperature melting phase and a high temperature melting phase; where the low temperature melting phase melts at a temperature that is lower than the high temperature melting phase; and a contracting constituent; where the contracting constituent exerts a compressive force on the metal alloy matrix at a temperature between a melting point of the low temperature melting phase and a melting point of the high temperature melting phase or below the melting points of the high and low temperature melting phases.

Abstract: Disclosed herein is a composite comprising a metal alloy matrix; where the metal alloy matrix comprises aluminum in an amount greater than 50 atomic percent; a first metal and a second metal; where the first metal is different from the second metal; and where the metal alloy matrix comprises a low temperature melting phase and a high temperature melting phase; where the low temperature melting phase melts at a temperature that is lower than the high temperature melting phase; and a contracting constituent; where the contracting constituent exerts a compressive force on the metal alloy matrix at a temperature between a melting point of the low temperature melting phase and a melting point of the high temperature melting phase or below the melting points of the high and low temperature melting phases.

Abstract: Disclosed herein is a composite comprising a metal alloy matrix; where the metal alloy matrix comprises aluminum in an amount greater than 50 atomic percent; a first metal and a second metal; where the first metal is different from the second metal; and where the metal alloy matrix comprises a low temperature melting phase and a high temperature melting phase; where the low temperature melting phase melts at a temperature that is lower than the high temperature melting phase; and a contracting constituent; where the contracting constituent exerts a compressive force on the metal alloy matrix at a temperature between a melting point of the low temperature melting phase and a melting point of the high temperature melting phase or below the melting points of the high and low temperature melting phases.

Abstract: Disclosed herein is a composite comprising a metal alloy matrix; where the metal alloy matrix comprises aluminum in an amount greater than 50 atomic percent; a first metal and a second metal; where the first metal is different from the second metal; and where the metal alloy matrix comprises a low temperature melting phase and a high temperature melting phase; where the low temperature melting phase melts at a temperature that is lower than the high temperature melting phase; and a contracting constituent; where the contracting constituent exerts a compressive force on the metal alloy matrix at a temperature between a melting point of the low temperature melting phase and a melting point of the high temperature melting phase or below the melting points of the high and low temperature melting phases.

Abstract: Disclosed herein is a composite comprising a metal alloy matrix; where the metal alloy matrix comprises aluminum in an amount greater than 50 atomic percent; a first metal and a second metal; where the first metal is different from the second metal; and where the metal alloy matrix comprises a low temperature melting phase and a high temperature melting phase; where the low temperature melting phase melts at a temperature that is lower than the high temperature melting phase; and a contracting constituent; where the contracting constituent exerts a compressive force on the metal alloy matrix at a temperature between a melting point of the low temperature melting phase and a melting point of the high temperature melting phase or below the melting points of the high and low temperature melting phases.

Abstract: Electrodes, infusion cannula, and interventional MRI instrumentation, are constructed with multiple layers or mixtures of metals or alloys that allow the diamagnetic behavior of some metals to combine with the paramagnetic behavior of others, wherein the devices have a magnetic susceptibility which is close to that of the material, for example body tissue, being im The material may thereby be imaged using MRI with resultant images having greatly reduced distortion. Optimal metal composites are determined through mathematical modeling and measurements. In particular, MR compatible susceptibility-matched electrodes may be used for stimulation and for acquiring electroencephalography (EEG) data before, during and after MR image and spectroscopy measurements, with a significant reduction in distortion of the resulting images and spectra. In accordance with the invention, these electrodes may further be incorporated into micro-electrode arrays.

Abstract: A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.

Abstract: A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.