Abstract: Ladar systems are provided. An exemplary ladar system includes a waveform generator for generating an arbitrary waveform, a laser for transmitting a modulated light signal toward a target, and a Doppler tracking loop for tracking the Doppler frequency shift between the transmitted light signal and a received reflected light signal.

Abstract: An imaging method and apparatus using an unmodulated pulsed laser with a chirp modulated receiver is provided for producing 3D plus intensity imagery of targets in heavily cluttered locations The apparatus includes a laser for emitting a laser beam and synchronizing a receiver to receive a reflected laser signal and transform the reflected laser signal into a displayable image that includes intensity information.

Abstract: Ladar systems are provided. An exemplary ladar system includes a waveform generator for generating an arbitrary waveform, a laser for transmitting a modulated light signal toward a target, and a Doppler tracking loop for tracking the Doppler frequency shift between the transmitted light signal and a received reflected light signal.

Abstract: An imaging method and apparatus using an unmodulated pulsed laser with a chirp modulated receiver is provided for producing 3D plus intensity imagery of targets in heavily cluttered locations The apparatus includes a laser for emitting a laser beam and synchronizing a receiver to receive a reflected laser signal and transform the reflected laser signal into a displayable image that includes intensity information.

Abstract: Methods and apparatus for generating a code-multiplexed readout value of photocurrents for a photo-detector array of cells are disclosed. Readout values are determined using a multiplexer and current amplifier for each cell and a current-to-voltage converter for each row of cells. The multiplexer multiplexes a photocurrent in an electrical domain for a respective cell using a code and generates electric currents responsive to the photocurrent. The current amplifier amplifies the electric currents. The current-to-voltage converter for each row generates the readout value for that row of the array responsive to the amplified electric currents.

Abstract: A test probe apparatus having a housing and a probe pin is provided. The housing includes a first housing end portion having a round tapered wall defining a tapered cavity. The probe pin includes a pin base portion rigidly mounted to the housing and a pin tip portion movably mounted to the housing for movement between a first position and a second position. At the first position, the pin tip portion is disposed in a spaced-apart relationship with the pin base portion and protrudes into the tapered cavity. At the second position, the pin tip portion is moved toward the pin base portion relative to the first position.

Abstract: A test probe apparatus having a housing and a probe pin is provided. The housing includes a first housing end portion having a round tapered wall defining a tapered cavity. The probe pin includes a pin base portion rigidly mounted to the housing and a pin tip portion movably mounted to the housing for movement between a first position and a second position. At the first position, the pin tip portion is disposed in a spaced-apart relationship with the pin base portion and protrudes into the tapered cavity. At the second position, the pin tip portion is moved toward the pin base portion relative to the first position.

Abstract: A method and assembly for a heat sink that is attached to a chip carrier. The heat sink has a plurality of fins extending from the first surface of a plate and a pair of rails extending from a second opposite surface of the plate. The rails are constructed to contain and restrain the heat sink on the chip carrier. The heat sink also has a recess and a pair of support surfaces between the rails. To attach the chip carrier to the heat sink, a thermally conductive adhesive is applied into the center of the recess. The chip carrier is then placed on the support surfaces between the rails. Mounting the carrier on the support surface pushes the adhesive throughout the recess. The adhesive cures at room temperature, wherein the heat sink is bonded to the chip carrier.