Patents by Inventor Charles S. Musante

Charles S. Musante has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flattened substrate surface for substrate bonding
    Patent number: 9355936
    Abstract: Methods for bonding substrate surfaces, bonded substrate assemblies, and design structures for a bonded substrate assembly. Device structures of a product chip are formed using a first surface of a device substrate. A wiring layer of an interconnect structure for the device structures is formed on the product chip. The wiring layer is planarized. A temporary handle wafer is removably bonded to the planarized wiring layer. In response to removably bonding the temporary handle wafer to the planarized first wiring layer, a second surface of the device substrate, which is opposite to the first surface, is bonded to a final handle substrate. The temporary handle wafer is then removed from the assembly.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: May 31, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Edward C. Cooney, III, James S. Dunn, Dale W. Martin, Charles S. Musante, BethAnn Rainey Lawrence, Leathen Shi, Edmund J. Sprogis, Cornelia K. Tsang
  • FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
    Publication number: 20140209908
    Abstract: Methods for bonding substrate surfaces, bonded substrate assemblies, and design structures for a bonded substrate assembly. Device structures of a product chip are formed using a first surface of a device substrate. A wiring layer of an interconnect structure for the device structures is formed on the product chip. The wiring layer is planarized. A temporary handle wafer is removably bonded to the planarized wiring layer. In response to removably bonding the temporary handle wafer to the planarized first wiring layer, a second surface of the device substrate, which is opposite to the first surface, is bonded to a final handle substrate. The temporary handle wafer is then removed from the assembly.
    Type: Application
    Filed: April 1, 2014
    Publication date: July 31, 2014
    Applicant: International Business Machines Corporation
    Inventors: Edward C. Cooney, III, James S. Dunn, Dale W. Martin, Charles S. Musante, BethAnn Rainey Lawrence, Leathen Shi, Edmund J. Sprogis, Cornelia K. Tsang