Patents by Inventor Charles Sanford Goodwin

Charles Sanford Goodwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diodes and a method of packaging the same
    Patent number: 9418979
    Abstract: Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: August 16, 2016
    Assignee: RENSSEALER POLYTECHNIC INSTITUTE
    Inventors: Robert F. Karlicek, Jr., James Jian-Qiang Lu, Charles Sanford Goodwin, Anton Tkachenko
  • LIGHT EMITTING DIODES AND A METHOD OF PACKAGING THE SAME
    Publication number: 20160111408
    Abstract: Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
    Type: Application
    Filed: December 14, 2015
    Publication date: April 21, 2016
    Inventors: Robert F. Karlicek, JR., James Jian-Qiang Lu, Charles Sanford Goodwin, Anton Tkachenko
  • Light emitting diodes and a method of packaging the same
    Patent number: 9245875
    Abstract: Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: January 26, 2016
    Assignee: RENSSELAER POLYTECHNIC INSTITUTE
    Inventors: Robert F. Karlicek, James Jian-Qiang Lu, Charles Sanford Goodwin, Anton Tkachenko
  • LIGHT EMITTING DIODES AND A METHOD OF PACKAGING THE SAME
    Publication number: 20150050761
    Abstract: Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
    Type: Application
    Filed: April 19, 2013
    Publication date: February 19, 2015
    Inventors: Robert F. Karlicek, James Jian-Qiang Lu, Charles Sanford Goodwin, Anton Tkachenko