Abstract: Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.

Abstract: A head cleaning method performed by a liquid discharge apparatus including a head configured to discharge a resist containing an acrylic monomer as a main component is provided. The method comprises using a cleaning solution to clean a discharge surface of the head and a vicinity of the discharge surface, wherein a difference between a dissolution parameter (SP value) of the cleaning solution and a dissolution parameter of the resist falls within a range of ±2.