Abstract: A method is disclosed whereby identification information can be encoded onto a plurality of circuit dice on a wafer to enable each of them to be distinguished from one another. An array of electrically readable identification elements, such as resistors, is disposed on each of the circuit dice during the circuit fabrication process. A first mask is then positioned over the each of the dice which completely covers all but the identification elements. A step and repeat mask is then selectively positioned over a particular element or elements in the array which identify a circuit die by its location on the wafer. The die is then exposed using a conventional step and repeat photolithographic process so that only the selected identification element or elements in the array will remain. The second mask is then stepped over the next circuit die on the wafer but is positioned over a different identification element or elements in the array.