Abstract: A method of monitoring the temperature of a solid state switch in an aircraft solid state power controller. The method includes: measuring an electric current (I) flowing through the solid state switch; calculating, based on the measured electric current (I), an introduced electric power (Pel) that is introduced into the solid state switch within the predefined time period (?t); calculating an increase in temperature (?T) of the solid state switch that is caused by the introduced electric power (Pel); calculating an actual temperature (Tact) of the solid state switch by adding the calculated increase in temperature (?T) to an ambient temperature (Tamb); and comparing the calculated actual temperature (Tact) with a predefined temperature threshold (Tth) and determining an overheat condition if the calculated actual temperature (Tact) exceeds the predefined temperature threshold (Tth).

Abstract: The present application provides spirocyclic lactam compounds that modulate the activity of the V617F variant of JAK2, which are useful in the treatment of various diseases, including cancer.

Abstract: A fluid-cooled electrical component includes a housing having a bottom wall, an outer wall extending from a first surface of the bottom wall, an inner wall extending from the first surface of the bottom wall, the outer and inner walls forming a first cavity therebetween, and the inner wall forming a second cavity therewithin, and one or more fluid channels formed in the inner wall of the housing, adapted and configured to pass a cooling fluid therethrough. The fluid-cooled electrical component also includes a first electrical component disposed in the first cavity, and a second electrical component disposed in the second cavity, both the first and second electrical components being adapted and configured to expel heat through the housing, into the cooling fluid.

Abstract: A method of electrically connecting a bundle of insulated conductors in accordance with a non-limiting example includes installing an insulation portion of a plurality of electrical conductors into a connector having an axial outer surface. The insulation portion covers an electrically conductive portion. The method further includes exposing a terminal end of each of the plurality of electrical conductors at the axial outer surface, and depositing an electrically conductive material onto the terminal end of each of the plurality of electrical conductors at the axial outer surface of the connector such that the electrically conductive material electrically connects the electrically conductive portion of each of the plurality of electrical conductors.

Abstract: An inductor includes a printed wiring board (PWB) and a plurality of electrically-conductive heat pipes operatively connected to the PWB. The PWB includes electrically conductive traces electrically connected to the plurality of electrically-conductive heat pipes. The traces and plurality of electrically conductive heat pipes form an inductor winding. A method of manufacturing an inductor includes mounting a plurality of electrically conductive heat pipes to a printed wiring board (PWB), wherein the PWB includes electrically conductive traces to connect the plurality of electrically-conductive heat pipes to form an inductor winding.

Abstract: An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described.

Abstract: An immersion cooled electronics arrangement includes a housing containing a coolant, an electronic device submerged within the housing and in thermal communication with the coolant, and a variable volume body. The variable volume body is disposed within the housing. An actuator is operatively connected to the variable volume body and is arranged to displace coolant within the housing.

Abstract: A magnetic device includes an electrically insulating body and a conductor coil. The insulating body defines an internal cavity for a magnetic device core and a coolant channel routed about the internal cavity. The conductor coil extends through the insulating body and winds about the internal cavity. The electrically insulating body electrically insulates the internal cavity and coolant channel from the conductor coil.

Abstract: An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.

Abstract: A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

Abstract: An immersion cooled electronics arrangement includes a sealed housing, a coolant contained within the sealed housing, and an electronic device disposed within the sealed housing. The sealed housing has a variable-volume alterable between at least a first volume and a second volume in response to changes in pressure within the sealed housing to reduce the rate of pressure change in the sealed housing over time from heating of the coolant.

Abstract: An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic device has a passageway with at least one inlet and at least one outlet and is configured to allow fluid flowing between the inlet and the outlet to cool the electronic device.

Abstract: An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic device has a passageway with at least one inlet and at least one outlet and is configured to allow fluid flowing between the inlet and the outlet to cool the electronic device.

Abstract: An inductor includes a printed wiring board (PWB) and a plurality of electrically-conductive heat pipes operatively connected to the PWB. The PWB includes electrically conductive traces electrically connected to the plurality of electrically-conductive heat pipes. The traces and plurality of electrically conductive heat pipes form an inductor winding. A method of manufacturing an inductor includes mounting a plurality of electrically conductive heat pipes to a printed wiring board (PWB), wherein the PWB includes electrically conductive traces to connect the plurality of electrically-conductive heat pipes to form an inductor winding.

Abstract: An immersion cooled electronics arrangement includes a housing containing a coolant, an electronic device submerged within the housing and in thermal communication with the coolant, and a variable volume body. The variable volume body is disposed within the housing. An actuator is operatively connected to the variable volume body and is arranged to displace coolant within the housing.

Abstract: An air damper assembly for regulating an air flow includes a frame, a plurality of elongated damper blade rotatably mounted to the frame, and a drive mechanism for actuating the damper blades between open and closed positions. The drive mechanism includes a gear fixedly secured to a distal end of each of the damper blades and an elongated rack slidably coupled to the frame. The rack meshingly engages the gears such that linear movement of the rack in a first linear direction results in rotational movement of the damper blades in a first rotational direction and linear movement of the rack in a second linear direction opposite the first linear direction results in rotational movement of the damper blades in a second, rotational direction opposite the first rotational direction.

Abstract: A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

Abstract: A transformer assembly includes a housing with a sealed housing interior, a transformer disposed within the housing interior and having a core with windings wrapped about the core, and a condenser mounted to the housing. The condenser is in fluid communication with the housing interior. A surface of the windings bounds a coolant channel extending between the windings and the condenser to convey coolant of a first phase to the condenser and receive coolant of a second phase from the condenser.

Abstract: An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic device has a passageway with at least one inlet and at least one outlet and is configured to allow fluid flowing between the inlet and the outlet to cool the electronic device.

Abstract: An immersion cooled electronics arrangement includes a sealed housing, a coolant contained within the sealed housing, and an electronic device disposed within the sealed housing. The sealed housing has a variable-volume alterable between at least a first volume and a second volume in response to changes in pressure within the sealed chamber to reduce the rate of pressure change in the sealed housing over time form heating of the coolant.