Abstract: An adjustable pick or plectrum for a stringed musical instrument is characterized by a top grip portion and a bottom tip portion, the top grip portion adapted to matingly receive the bottom tip portion through an engagement means. The top grip portion preferably has at least one slot or channel which is adapted to receive and retain at least one leg from the bottom tip portion. Preferably, each leg has one or more protrusions, so that selective holes or slots in the top grip portion are adapted to selectively receive, engage and retain each protrusion. The pick is adapted for height adjustability and/or angular adjustability as desired by the musician. The height adjustability can be set in selected positions for different flexibilities. It is seen that this pick has a multi use capability, adjustable from a solid pick through several different flexibilities, heights and angles.

Abstract: An adjustable pick or plectrum for a stringed musical instrument is characterized by a top grip portion and a bottom tip portion, the top grip portion adapted to matingly receive the bottom tip portion through an engagement means. The top grip portion preferably has at least one slot or channel which is adapted to receive and retain at least one leg from the bottom tip portion. Preferably, each leg has one or more protrusions, so that selective holes or slots in the top grip portion are adapted to selectively receive, engage and retain each protrusion. The pick is adapted for height adjustability and/or angular adjustability as desired by the musician. The height adjustability can be set in selected positions for different flexibilities. It is seen that this pick has a multi use capability, adjustable from a solid pick through several different flexibilities, heights and angles.

Abstract: A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.

Abstract: This invention relates to an apparatus, device or method for manufacturing a grip plectrum or pick formed from a first material (such as, for example, plastic or like material), the plectrum having in one embodiment a generally triangular shaped body with a broad top portion, an intermediate portion, and a narrow bottom portion, with the top and intermediate portion being substantially covered with a second material that has a greater degree of grip than the first material. The plectrum has a generally triangular (and preferably tear-drop) shaped body being made from a first material. A top and intermediate portion of the plectrum are substantially or completely covered by a second material on all four sides (front surface, back surface and both side surfaces) and is adapted to be gripped by the user between the thumb and index finger, with a bottom portion being used to pluck the instrument strings. In one embodiment, the second material is preferably a non-slip material such as rubber or the like.

Abstract: A method of manufacturing an integrated circuit in which the method comprises exposing a wafer to an energy source defining a focal plane with which a depth of focus is associated and conforming the wafer to substantially correspond with the focal plane.

Abstract: Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier.

Abstract: Disclosed herein is an improved carrier design for use in a chemical mechanical polishing process. The carrier employs a retainer ring that is fastened to the side of carrier, as opposed to the front of the carrier, which alleviates undesired uneven wear of the retainer ring surface. Specifically exemplified herein is a carrier comprising a membrane that is secured to the carrier body by a retainer ring that is snap-fitted to the carrier body.

Abstract: A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.

Abstract: A carrier head for supporting a wafer during a chemical mechanical polishing process is provided. In one exemplary implementation, the carrier head may comprise a wear ring, and a slidably movable pressure plate disposed within the wear ring. The pressure plate may be arranged to provide slidable movement relative to the wear ring. This degree of freedom can accommodate height dimensional changes that may occur in the wear ring.

Abstract: A conditioner assembly is disclosed for conditioning a polishing pad used in chemical mechanical polishing of planar semiconductor wafer components. One embodiment of the conditioner assembly comprises a plate-type conditioner plate comprising a circular edge, having a first side and a second side, where on the first side is provided one or more diamond-impregnated abrasive elements, each comprising an abrasive surface disposed a distance from said first side comprising diamond particles, and one or more jets oriented to discharge fluid away from said first side. In operation the jets dispense high velocity fluid that hits the surface of the adjacent polishing pad with sufficient force to dislodge diamond particles that have loosened or broken off from the diamond-impregnated abrasive elements, thereby avoiding the embedding of such particles into the polishing pad surface.

Abstract: A chemical mechanical polishing (CMP) pad is provided. The CMP pad includes a groove pattern disposed on a polishing surface of the pad. The groove pattern is formed of an alternating sequence of spaced apart grooves. The alternating sequence of grooves comprises a groove of a first size and a groove of a second size, wherein the first and second groove sizes are different relative to one another.

Abstract: A method for activating air bags in motor vehicles without the use of electrically powered deceleration sensors. This method utilizes the impact of one mass of quartz against another to generate a flash of visible light to initiate activation of the air bag system under conditions of extremely sudden deceleration. This flash of light, which is detected by a photo-sensitive element, initiates deployment of the air bag system without reliance on the electrical cables currently used for this purpose, but which could be damaged in the first moment of a collision, thus preventing inflation of the air bags. This substitution of a photo-sensitive activation system for a system dependent on electric cables substantially enhances the reliability of the air bag deployment concept.