Patents by Inventor Charles TIPHINE

Charles TIPHINE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10534255
    Abstract: A method of geometry corrections to properly transfer semiconductor designs on a wafer or a mask in nanometer scale processes is provided. In contrast with some prior art techniques, geometry corrections and possibly dose corrections are applied before fracturing. Unlike edge based corrections, where the edges are displaced in parallel, the displacements applied to generated geometry corrections do not preserve parallelism of the edges, which is specifically well suited for free form designs. A seed design is generated from the target design. Vertices connecting segments are placed along the seed design contour. Correction sites are placed on the segments. Displacement vectors are applied to the vertices. A simulated contour is generated and compared to the contour of the target design. The process is iterated until a match criteria between simulated and target design (or another stop criteria) is reached.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: January 14, 2020
    Assignee: ASELTA NANOGRAPHICS
    Inventors: Thomas Quaglio, Mathieu Millequant, Charles Tiphine
  • Patent number: 10157728
    Abstract: A method of generating data relative to the writing of a pattern by electronic radiation initially includes the provision of a pattern to be formed which form the work pattern with a single external envelope. The work pattern is broken down into a set of elementary outlines, each including a single external envelope. A set of insolation conditions is defined to model each elementary outline. An irradiated simulation pattern is calculated from the sets of insolation conditions associated with the sets of elementary outlines. The simulation pattern is compared with the pattern to be formed. If the simulation pattern is not representative of the pattern to be formed, shift vectors are calculated. The shift vectors are representative of different intervals existing between the two patterns. The external envelope of the pattern to be formed is modified from displacement vectors determined from the shift vectors. A new iteration is carried out.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: December 18, 2018
    Assignee: ASELTA NANOGRAPHICS
    Inventors: Charles Tiphine, Sébastien Bayle
  • Publication number: 20180267399
    Abstract: A method of geometry corrections to properly transfer semiconductor designs on a wafer or a mask in nanometer scale processes is provided. In contrast with some prior art techniques, geometry corrections and possibly dose corrections are applied before fracturing. Unlike edge based corrections, where the edges are displaced in parallel, the displacements applied to generated geometry corrections do not preserve parallelism of the edges, which is specifically well suited for free form designs. A seed design is generated from the target design. Vertices connecting segments are placed along the seed design contour. Correction sites are placed on the segments. Displacement vectors are applied to the vertices. A simulated contour is generated and compared to the contour of the target design. The process is iterated until a match criteria between simulated and target design (or another stop criteria) is reached.
    Type: Application
    Filed: December 22, 2015
    Publication date: September 20, 2018
    Inventors: Thomas QUAGLIO, Mathieu MILLEQUANT, Charles TIPHINE
  • Patent number: 9922159
    Abstract: The invention discloses a computer implemented method of fracturing a surface into elementary features wherein the desired pattern has a rectilinear or curvilinear form. Depending upon the desired pattern, a first fracturing will be performed of a non-overlapping or an overlapping type. If the desired pattern is resolution critical, it will be advantageous to perform a second fracturing step using eRIFs. These eRIFs will be positioned either on the edges or on the medial axis or skeleton of the desired pattern. The invention further discloses method steps to define the position and shape of the elementary features used for the first and second fracturing steps.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: March 20, 2018
    Assignee: ASELTA NANOGRAPHICS
    Inventors: Charles Tiphine, Thomas Quaglio, Luc Martin
  • Publication number: 20160079033
    Abstract: A method of generating data relative to the writing of a pattern by electronic radiation initially includes the provision of a pattern to be formed which form the work pattern with a single external envelope. The work pattern is broken down into a set of elementary outlines, each including a single external envelope. A set of insolation conditions is defined to model each elementary outline. An irradiated simulation pattern is calculated from the sets of insolation conditions associated with the sets of elementary outlines. The simulation pattern is compared with the pattern to be formed. If the simulation pattern is not representative of the pattern to be formed, shift vectors are calculated. The shift vectors are representative of different intervals existing between the two patterns. The external envelope of the pattern to be formed is modified from displacement vectors determined from the shift vectors. A new iteration is carried out.
    Type: Application
    Filed: April 17, 2014
    Publication date: March 17, 2016
    Inventors: Charles TIPHINE, Sébastien BAYLE
  • Publication number: 20150154344
    Abstract: The invention discloses a computer implemented method of fracturing a surface into elementary features wherein the desired pattern has a rectilinear or curvilinear form. Depending upon the desired pattern, a first fracturing will be performed of a non-overlapping or an overlapping type. If the desired pattern is resolution critical, it will be advantageous to perform a second fracturing step using eRIFs. These eRIFs will be positioned either on the edges or on the medial axis or skeleton of the desired pattern. The invention further discloses method steps to define the position and shape of the elementary features used for the first and second fracturing steps.
    Type: Application
    Filed: February 6, 2015
    Publication date: June 4, 2015
    Inventors: Charles TIPHINE, Thomas QUAGLIO, Luc MARTIN
  • Patent number: 8984451
    Abstract: The invention discloses a computer implemented method of fracturing a surface into elementary features wherein the desired pattern has a rectilinear or curvilinear form. Depending upon the desired pattern, a first fracturing will be performed of a non-overlapping or an overlapping type. If the desired pattern is resolution critical, it will be advantageous to perform a second fracturing step using eRIFs. These eRIFs will be positioned either on the edges or on the medial axis or skeleton of the desired pattern. The invention further discloses method steps to define the position and shape of the elementary features used for the first and second fracturing steps.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: March 17, 2015
    Assignee: Aselta Nanographics
    Inventors: Charles Tiphine, Thomas Quaglio, Luc Martin
  • Publication number: 20140245240
    Abstract: The invention discloses a computer implemented method of fracturing a surface into elementary features wherein the desired pattern has a rectilinear or curvilinear form. Depending upon the desired pattern, a first fracturing will be performed of a non-overlapping or an overlapping type. If the desired pattern is resolution critical, it will be advantageous to perform a second fracturing step using eRIFs. These eRIFs will be positioned either on the edges or on the medial axis or skeleton of the desired pattern. The invention further discloses method steps to define the position and shape of the elementary features used for the first and second fracturing steps.
    Type: Application
    Filed: February 22, 2013
    Publication date: August 28, 2014
    Applicant: ASELTA NANOGRAPHICS
    Inventors: Charles TIPHINE, Thomas QUAGLIO, Luc MARTIN