Patents by Inventor Charles Valverde

Charles Valverde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacture of electroless cobalt deposition compositions for microelectronics applications
    Patent number: 7704306
    Abstract: A method of preparing an aqueous electroless deposition composition for electrolessly depositing Co or a Co alloy onto a substrate in manufacture of microelectronic devices by treating water or an aqueous electroless deposition composition with a deoxygenating treatment to reduce the oxygen concentration.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: April 27, 2010
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Richard Hurtubise, Vincent Paneccasio, Charles Valverde, Daniel Stritch
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7615491
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 10, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7611988
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 3, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7611987
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 3, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • METROLOGY IN ELECTROLESS COBALT PLATING
    Publication number: 20090155468
    Abstract: Electrolessly depositing a cobalt-based alloy on a metal surface of a substrate in a process which involves monitoring for Co3+ ion concentration in a sample of the electroless cobalt deposition composition during said contacting; and replacing or regenerating the electroless cobalt deposition composition when the concentration of Co3+ ions exceeds a predetermined concentration of Co3+ ions.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 18, 2009
    Applicant: ENTHONE INC.
    Inventors: Nicolai Petrov, Paul Figura, Qingyun Chen, Charles Valverde, Richard Hurtubise
  • SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPOSITION FOR THIN CO-BASED AND NI-BASED ALLOYS
    Publication number: 20080254205
    Abstract: A method and composition for electrolessly depositing a layer of a metal alloy onto a surface of a metal substrate in manufacture of microelectronic devices. The composition comprises a source of metal deposition ions, a borane-based reducing agent, and a two-component stabilizer, wherein the first stabilizer component is a source of hypophosphite and the second stabilizer component is a molybdenum (VI) compound.
    Type: Application
    Filed: April 13, 2007
    Publication date: October 16, 2008
    Applicant: ENTHONE INC.
    Inventors: Nicolai Petrov, Charles Valverde, Qingyun Chen, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Patent number: 7410899
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: August 12, 2008
    Assignee: Enthone, Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • MANUFACTURE OF ELECTROLESS COBALT DEPOSITION COMPOSITIONS FOR MICROELECTRONICS APPLICATIONS
    Publication number: 20080090414
    Abstract: A method of preparing an aqueous electroless deposition composition for electrolessly depositing Co or a Co alloy onto a substrate in manufacture of microelectronic devices by treating water or an aqueous electroless deposition composition with a deoxygenating treatment to reduce the oxygen concentration.
    Type: Application
    Filed: October 16, 2006
    Publication date: April 17, 2008
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Richard Hurtubise, Vincent Paneccasio, Charles Valverde, Daniel Stritch
  • Cobalt and nickel electroless plating in microelectronic devices
    Patent number: 7332193
    Abstract: An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: February 19, 2008
    Assignee: Enthone, Inc.
    Inventors: Charles Valverde, Nicolai Petrov, Eric Yakobson, Qingyun Chen, Vincent Paneccasio, Jr., Richard Hurtubise, Christian Witt
  • Defectivity and process control of electroless deposition in microelectronics applications
    Publication number: 20070062408
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: October 5, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Publication number: 20070066058
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: October 5, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Publication number: 20070066057
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Defectivity and process control of electroless deposition in microelectronics applications
    Publication number: 20070066059
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: October 5, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubies
  • Cobalt electroless plating in microelectronic devices
    Publication number: 20060280860
    Abstract: An electroless plating method and composition for depositing Co or Co alloys onto a metal-based substrate in manufacture of microelectronic devices, involving a source of Co ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and an oxime-based compound stabilizer.
    Type: Application
    Filed: June 9, 2005
    Publication date: December 14, 2006
    Applicant: Enthone Inc.
    Inventors: Vincent Paneccasio, Qingyun Chen, Charles Valverde, Nicolai Petrov, Christian Witt, Richard Hurtubise
  • Cobalt self-initiated electroless via fill for stacked memory cells
    Publication number: 20060188659
    Abstract: A method for electrolessly filling a stacked memory cell interconnect feature comprising electroless deposition from a composition comprising Co ions and a reducing agent by bottom-up filling initiated by reduction to Co metal on an electrically conducting bottom of the feature. An electroless deposition composition for electrolessly depositing Co in a high aspect ratio stacked memory cell interconnect feature, the composition comprising water, Co ions, a complexing agent, a buffering agent, a borane-based reducing agent component, and a hypophosphite reducing agent component. There is a concentration ratio of borane-based reducing agent to hypophosphite reducing agent of less than about 0.5.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 24, 2006
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Richard Hurtubise, Christian Witt, Joseph Abys, Daniel Stritch, Charles Valverde
  • Cobalt and nickel electroless plating in microelectronic devices
    Publication number: 20060083850
    Abstract: An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.
    Type: Application
    Filed: March 21, 2005
    Publication date: April 20, 2006
    Applicant: Enthone Inc.
    Inventors: Charles Valverde, Nicolai Petrov, Eric Yakobson, Qingyun Chen, Vincent Paneccasio, Richard Hurtubise, Christian Witt