Abstract: A system and method for processing a semiconductor material out-gassing a gas including a radiant energy source arranged to expose the semiconductor material to energy to decompose the gas and a sensor to sense a parameter of processing such that the radiant energy source is controlled based upon the sensed parameter information.

Abstract: A method for a semiconductor process includes correlating yield loss for the performance of a processing step in a semiconductor manufacturing process with the mechanical placement of the semiconductor substrate and, based on the correlation, placing semiconductor substrates in a position with sufficient placement precision to reduce yield loss below a predetermined threshold.

Abstract: A system and method for reducing out-gassing, i.e. discharge or emissions, of corrosive vapors/gasses, such as Hydrogen Bromide, Hydrogen Chloride and/or Hydrogen Fluoride, from semiconductor processing equipment and processed semi-conductor materials, into the surrounding environment is disclosed. Out-gassing is the release of gases from the surfaces of a solid body. In the disclosed system and method, after the requisite semiconductor processing has completed, a radiant energy source, such as an ultraviolet light source is exposes the corrosive gas or processed semiconductor materials, e.g. wafers, while the gas or materials are still contained within the processing equipment. The ultraviolet light energy decomposes the corrosive gas into lesser corrosive components thereof, i.e. disassociates the molecules of the corrosive gas. The disassociated species may then combine into volatile molecules that may be evacuated through the pumping system to an exhaust system.