Patents by Inventor Charles W. Blackmer
Charles W. Blackmer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10829366Abstract: Disclosed is a method of forming an interconnect in a substrate having a first surface and a second surface. The method includes forming an insulating structure abutting the first surface and defining a closed loop around a via in the substrate and forming an insulating region abutting the second surface such that the insulating region contacts the insulating structure and separates the via from a bulk region of the substrate. Forming the insulating structure includes etching the substrate beginning from the first surface to form a trench, filling the trench to form a seam portion, and converting a first portion of the substrate to a first solid portion to form the closed loop.Type: GrantFiled: March 30, 2018Date of Patent: November 10, 2020Assignee: Kionix, Inc.Inventors: Scott G. Adams, Charles W. Blackmer
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Patent number: 10393605Abstract: Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.Type: GrantFiled: December 7, 2016Date of Patent: August 27, 2019Assignee: Kionix, Inc.Inventors: Scott G. Adams, Charles W. Blackmer, Kristin J. Lynch
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Patent number: 10315915Abstract: Disclosed are systems, methods, and computer program products for electronic systems with through-substrate interconnects and mems device. An interconnect formed in a substrate having a first surface and a second surface, the interconnect includes: a bulk region; a via extending from the first surface to the second surface; an insulating structure extending through the first surface into the substrate and defining a closed loop around the via, wherein the insulating structure comprises a seam portion separated by at least one solid portion; and an insulating region extending from the insulating structure toward the second surface, the insulating region separating the via from the bulk region, wherein the insulating structure and insulating region collectively provide electrical isolation between the via and the bulk region.Type: GrantFiled: July 2, 2015Date of Patent: June 11, 2019Assignee: Kionix, Inc.Inventors: Scott G. Adams, Charles W. Blackmer
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Publication number: 20180222746Abstract: Disclosed is a method of forming an interconnect in a substrate having a first surface and a second surface. The method includes forming an insulating structure abutting the first surface and defining a closed loop around a via in the substrate and forming an insulating region abutting the second surface such that the insulating region contacts the insulating structure and separates the via from a bulk region of the substrate. Forming the insulating structure includes etching the substrate beginning from the first surface to form a trench, filling the trench to form a seam portion, and converting a first portion of the substrate to a first solid portion to form the closed loop.Type: ApplicationFiled: March 30, 2018Publication date: August 9, 2018Inventors: Scott G. Adams, Charles W. Blackmer
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Publication number: 20170089785Abstract: Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.Type: ApplicationFiled: December 7, 2016Publication date: March 30, 2017Inventors: Scott G. Adams, Charles W. Blackmer, Kristin J. Lynch
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Patent number: 9541462Abstract: Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.Type: GrantFiled: August 29, 2014Date of Patent: January 10, 2017Assignee: Kionix, Inc.Inventors: Scott G. Adams, Charles W. Blackmer, Kristin J. Lynch
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Publication number: 20170001858Abstract: Disclosed are systems, methods, and computer program products for electronic systems with through-substrate interconnects and mems device. An interconnect formed in a substrate having a first surface and a second surface, the interconnect includes: a bulk region; a via extending from the first surface to the second surface; an insulating structure extending through the first surface into the substrate and defining a closed loop around the via, wherein the insulating structure comprises a seam portion separated by at least one solid portion; and an insulating region extending from the insulating structure toward the second surface, the insulating region separating the via from the bulk region, wherein the insulating structure and insulating region collectively provide electrical isolation between the via and the bulk region.Type: ApplicationFiled: July 2, 2015Publication date: January 5, 2017Inventors: Scott G. ADAMS, Charles W. BLACKMER
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Publication number: 20160061679Abstract: Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.Type: ApplicationFiled: August 29, 2014Publication date: March 3, 2016Inventors: Scott G. Adams, Charles W. Blackmer, Kristin J. Lynch
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Patent number: 8853803Abstract: A micro-electromechanical system (MEMS) device can include a substrate and a first beam suspended relative to a substrate surface. The first beam can include a first portion and a second portion that are separated by an isolation joint made of an insulative material. The first and second portions can each include a first semiconductor and a first dielectric layer. The MEMS device can also include a second beam suspended relative to the substrate surface. The second beam can include a second semiconductor and a second dielectric layer to promote curvature of the second beam. The MEMS device can also include a third beam suspended relative to the substrate surface. The third beam consists essentially of a first material. The second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.Type: GrantFiled: August 10, 2012Date of Patent: October 7, 2014Assignee: Kionix, Inc.Inventors: Scott G. Adams, Andrew J. Minnick, Charles W. Blackmer, Mollie K. Devoe
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Patent number: 8664731Abstract: In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.Type: GrantFiled: February 14, 2011Date of Patent: March 4, 2014Assignee: Kionix, Inc.Inventors: Charles W. Blackmer, Scott G. Adams, Andrew S. Hocking, Kristin J. Lynch, Ashish A. Shah
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Publication number: 20130026584Abstract: A micro-electromechanical system (MEMS) device can include a substrate and a first beam suspended relative to a substrate surface. The first beam can include a first portion and a second portion that are separated by an isolation joint made of an insulative material. The first and second portions can each include a first semiconductor and a first dielectric layer. The MEMS device can also include a second beam suspended relative to the substrate surface. The second beam can include a second semiconductor and a second dielectric layer to promote curvature of the second beam. The MEMS device can also include a third beam suspended relative to the substrate surface. The third beam consists essentially of a first material. The second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.Type: ApplicationFiled: August 10, 2012Publication date: January 31, 2013Applicant: Kionix, Inc.Inventors: Scott G. ADAMS, Andrew J. MINNICK, Charles W. BLACKMER, Mollie K. DEVOE
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Patent number: 8319254Abstract: A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.Type: GrantFiled: February 14, 2011Date of Patent: November 27, 2012Assignee: Kionix, Inc.Inventors: Scott G. Adams, Andrew J. Minnick, Charles W. Blackmer, Mollie K. Devoe
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Publication number: 20120205752Abstract: In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.Type: ApplicationFiled: February 14, 2011Publication date: August 16, 2012Applicant: Kionix, Inc.Inventors: Charles W. Blackmer, Scott G. Adams, Andrew S. Hocking, Kristin J. Lynch, Ashish A. Shah
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Publication number: 20120205753Abstract: A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first, second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.Type: ApplicationFiled: February 14, 2011Publication date: August 16, 2012Applicant: Kionix, Inc.Inventors: Scott G. ADAMS, Andrew J. Minnick, Charles W. Blackmer, Kenneth D. Brennan, Mollie K. Devoe