Patents by Inventor Charles W. Paul

Charles W. Paul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES
    Publication number: 20160031134
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 4, 2016
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • Reactive hot melt adhesive
    Patent number: 9212300
    Abstract: High green strength reactive hot melt adhesives are prepared using silane-functional liquid polymers. The adhesive are formulated using a silane-reactive polymer or, alternatively, a non-silane-reactive polymer together with a compatible tackifier.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: December 15, 2015
    Assignee: Henkel AG & Co. KGaA
    Inventors: Charles W. Paul, Wu Suen, David J. Good
  • Low application temperature amorphous poly-?-olefin adhesive
    Patent number: 9193891
    Abstract: It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105° C. and viscosity of less than about 1,900 cP at 190° C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: November 24, 2015
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Charles W. Paul, Darshak Desai, Salvador Alvarado
  • Molding and overmolding compositions for electronic devices
    Patent number: 9127153
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 8, 2015
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • ADHESIVE COMPOSITIONS AND USE THEREOF
    Publication number: 20150225611
    Abstract: The invention provides adhesives comprising at least one polymer component which contains at least 65 weight percent propylene, at least one nucleator and at least one functionalized wax. The inventive adhesives have increased heat resistance and decreased set-time, making them particularly well suited for assembly and packaging applications.
    Type: Application
    Filed: April 27, 2015
    Publication date: August 13, 2015
    Inventors: Richard ELLIS, Charles W. Paul, Dirk Kasper, Petra Padurschel, Andrea Eodice
  • LOW APPLICATION TEMPERATURE AMORPHOUS POLY-a-OLEFIN ADHESIVE
    Publication number: 20150166851
    Abstract: It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105° C. and viscosity of less than about 1,900 cP at 190° C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.
    Type: Application
    Filed: March 2, 2015
    Publication date: June 18, 2015
    Inventors: Yuhong Hu, Charles W. Paul, Darshak Desai, Salvador Alvarado
  • Low application tempearature amorphous poly-?-olefin adhesive
    Patent number: 9000079
    Abstract: It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105° C. and viscosity of less than about 1,900 cP at 190° C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: April 7, 2015
    Assignee: Henkel IP & Holding GmbH
    Inventors: Yuhong Hu, Charles W. Paul, Darshak Desai, Salvador Alvarado
  • CURABLE ENCAPSULANTS AND USE THEREOF
    Publication number: 20150056757
    Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.
    Type: Application
    Filed: October 31, 2014
    Publication date: February 26, 2015
    Inventors: Yuxia Liu, Mark Konarski, Charles W. Paul, Peter D. Palasz
  • Adhesive compositions and use thereof
    Patent number: 8921464
    Abstract: The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. The adhesives find particular use as case, carton, and tray forming, and as sealing adhesives, including heat sealing applications, for example in the packaging of cereals, cracker and beer products.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: December 30, 2014
    Assignee: Henkel US IP LLC
    Inventors: Yayun Liu, Charles W. Paul, Allison Xiao, Andrea Eodice
  • Hot melt adhesive comprising cyanoacrylate curing compounds
    Patent number: 8877868
    Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl (meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: November 4, 2014
    Assignees: Henkel IP & Holding GmbH, Henkel US IP LLC
    Inventors: Marcus Heemann, Charles W. Paul, Maria Xenidou, Maja Schroeder, Sebastian Kostyra, Marisa Phelan
  • CATIONIC UV-CROSSLINKABLE ACRYLIC POLYMERS FOR PRESSURE SENSITIVE ADHESIVES
    Publication number: 20140303274
    Abstract: An ultraviolet (UV) crosslinkable acrylic pressure sensitive adhesive comprises an acrylic copolymer and a cationic photoinitiator. The acrylic copolymer comprises pendant reactive functional groups. The pressure sensitive adhesive formed from the acrylic copolymer with the pendant reactive functional groups result in high green strength and/or high temperature holding strength of the adhesive.
    Type: Application
    Filed: June 19, 2014
    Publication date: October 9, 2014
    Inventors: Yuxia Liu, Peter Palasz, Charles W. Paul, Paul B. Foreman
  • HOT MELT ADHESIVE COMPRISING CYANOACRYLATE CURING COMPOUNDS
    Publication number: 20140238603
    Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl(meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 28, 2014
    Applicants: Henkel AG & Co. KGaA, Henkel Ireland Limited, Henkel Corporation
    Inventors: Marcus Heemann, Charles W. Paul, Maria Xenidou, Maja Schroeder, Sebastian Kostyra, Marisa Phelan
  • TWO PART HYBRID ADHESIVE
    Publication number: 20140235793
    Abstract: Provided are two part hybrid adhesives that comprise an organoborane amine complex, a polyamine, a component polymerizable by free radical polymerization, and a polyisocyanate component. An isocyanate terminated prepolymer can advantageously be used in the practice of the invention. The adhesive is particularly well suited for low surface energy plastic bonding.
    Type: Application
    Filed: April 30, 2014
    Publication date: August 21, 2014
    Applicant: Henkel US IP LLC
    Inventors: Yongxia Wang, Charles W. Paul
  • Cationic UV-crosslinkable acrylic polymers for pressure sensitive adhesives
    Patent number: 8796350
    Abstract: An ultraviolet (UV) crosslinkable acrylic pressure sensitive adhesive comprises an acrylic copolymer and a cationic photoinitiator. The acrylic copolymer comprises pendant reactive functional groups. The pressure sensitive adhesive formed from the acrylic copolymer with the pendant reactive functional groups result in high green strength and/or high temperature holding strength of the adhesive.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: August 5, 2014
    Assignee: Henkel US IP LLC
    Inventors: Yuxia Liu, Peter Palasz, Charles W. Paul, Paul B. Foreman
  • Two part hybrid adhesive
    Patent number: 8742050
    Abstract: Provided are two part hybrid adhesives that comprise an organoborane amine complex, a polyamine, a component polymerizable by free radical polymerization, and a polyisocyanate component. An isocyanate terminated prepolymer can advantageously be used in the practice of the invention. The adhesive is particularly well suited for low surface energy plastic bonding.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: June 3, 2014
    Assignee: Henkel US IP LLC
    Inventors: Yongxia Wang, Charles W. Paul
  • MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES
    Publication number: 20140127445
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 8, 2014
    Applicant: Henkel Corporation
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • Acrylic pressure sensitive adhesive formulation and articles comprising same
    Patent number: 8440304
    Abstract: Pressure sensitive adhesive formulations of an acrylic polymer grafted with a macromer are particularly well suited for use in the manufacture of impact resistant articles such as impact resistant glass laminates and products comprising such laminates.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: May 14, 2013
    Assignee: Henkel Corporation
    Inventors: Charles W. Paul, Wu Suen
  • Hot melt adhesive
    Patent number: 8362125
    Abstract: Hot melt packaging adhesives comprising a base polymer component, a tackifier component and a wax component, which wax component comprises a soy wax, and are described.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: January 29, 2013
    Assignee: Henkel AG & Co. KGAA
    Inventors: Lie-Zhong Gong, Dale L. Haner, Charles W. Paul, Qiwei He, Abhi Narthana
  • CATIONIC UV-CROSSLINKABLE ACRYLIC POLYMERS FOR PRESSURE SENSITIVE ADHESIVES
    Publication number: 20120329900
    Abstract: An ultraviolet (UV) crosslinkable acrylic pressure sensitive adhesive comprises an acrylic copolymer and a cationic photoinitiator. The acrylic copolymer comprises pendant reactive functional groups. The pressure sensitive adhesive formed from the acrylic copolymer with the pendant reactive functional groups result in high green strength and/or high temperature holding strength of the adhesive.
    Type: Application
    Filed: September 7, 2012
    Publication date: December 27, 2012
    Inventors: Yuxia Liu, Peter Palasz, Charles W. Paul, Paul B. Foreman
  • Pressure sensitive adhesive compositions and articles prepared using such compositions
    Patent number: 8101276
    Abstract: Articles prepared with a pressure sensitive adhesive prepared by combining an acrylic polymer and a silane-functional polymer, such as glass and plastic laminates, show improved impact resistance.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: January 24, 2012
    Assignee: Henkel Corporation
    Inventors: Charles W. Paul, Wu Suen