Patents by Inventor Charles W. Tinley

Charles W. Tinley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly for packaging microcircuits having gold plated grounding and insulating leads, and method
    Patent number: 4706382
    Abstract: A plated metal assembly used for packaging hybrid microcircuits features both insulated and grounding leads plated with successive layers of nickel and gold, the leads attached to a metal header which is plated only with nickel. A method for mass producing the assembly includes pre-plating the grounding leads, and brazing them to the header after the header and insulated leads have been assembled and plated.
    Type: Grant
    Filed: September 3, 1985
    Date of Patent: November 17, 1987
    Assignee: North American Philips Corporation
    Inventors: Albert V. Suppinger, Charles W. Tinley