Patents by Inventor Charles W. Wallick

Charles W. Wallick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4044201
    Abstract: A lead frame assembly of indefinite length having a pair of spaced parallel carrier strips, collapsible rungs extending between the strips at regular intervals along the length of the assembly and a number of leads extending inwardly from the opposed edges of the strip between the rungs. The rungs are collapsed inwardly to seat the ends of the leads against the sides of circuit modules previously positioned between the ends of the leads. The lead ends are seated in recesses in the circuit modules and are subsequently soldered to metalized surfaces on the modules. Following the bending of the leads, the carrier strips and rungs are cut away.
    Type: Grant
    Filed: October 6, 1975
    Date of Patent: August 23, 1977
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Charles W. Wallick
  • Patent number: 4012835
    Abstract: A lead frame assembly of indefinite length having a pair of spaced parallel carrier strips, collapsible rungs extending between the strips at regular intervals along the length of the assembly and a number of leads extending inwardly from the opposed edges of the strip between the rungs are collapsed inwardly to seat the ends of the leads against the sides of circuit modules previously positioned between the ends of the leads. The lead ends are seated in recesses in the circuit modules and are subsequently soldered to metalized surfaces on the modules. Following the bending of the leads, the carrier strips and rungs are cut away.
    Type: Grant
    Filed: September 17, 1974
    Date of Patent: March 22, 1977
    Assignee: E. I. Du Pont de Nemours and Co.
    Inventor: Charles W. Wallick
  • Patent number: 4003125
    Abstract: Apparatus for manufacturing dual in-line packages from a single continuous lead frame assembly and a number of leadless circuit modules. The apparatus includes a loading station where modules are positioned in spaces in the lead frame assembly, a closing station where leads carried by spaced carrier strips on both sides of the modules are moved toward the modules to engage the modules adjacent metalized pads and to collapse interconnecting rungs, a soldering station where the leads are soldered to the pads, a bending station where the leads are bent down with respect to the module through about 90 degrees, a cut off station for removing the carrier strips on either side of the lead frame assembly, and associated drives for moving the lead frame assembly past the various stations.
    Type: Grant
    Filed: November 3, 1975
    Date of Patent: January 18, 1977
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Charles W. Wallick