Abstract: A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes which serve as the connection between the semiconductor device and substrate circuitry. The method of manufacturing the flip chip assembly includes the steps of attaching an integrated circuit (IC) chip having a plurality of input/output terminal pads to a rigid or flexible substrate having a plurality of via holes. The via holes are aligned with the terminal pads so that the respective traces on the substrate can be connected to the respective terminal pads through the via holes. After attachment, the pre-deposited solder inside the via holes or on the terminal pads is re-flowed. This re-flow soldering process electrically connects the IC chip to the substrate. The solder can be deposited by plating, wave soldering, meniscus coating, and screen printing techniques.

Abstract: A flip chip assembly, and methods of making the same, including a substrate circuitry having a plurality of via apertures or holes, wherein preformed strips or wires hanging therein and filled conductive material together serve as the electrical connection between a semiconductor device and substrate circuitry. The method and device in accordance with the present invention may include attaching an integrated circuit (IC) chip to a rigid or flexible substrate circuitry having a plurality of pre-formed strips extending from patterned circuitry traces and hanging inside a plurality of through holes. These through holes are aligned and placed above the terminal pads so that the respective traces on the substrate can be readily connected to the respective input/output terminal pads of the IC chip through the leads inside the via apertures or holes.

Abstract: A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes in which pre-formed strips or leads inside the via holes serve as the connections between the semiconductor device and substrate circuitry. The assembling steps include attaching an integrated circuit (IC) chip having a plurality of input/output terminal pads to a rigid or flexible substrate having a plurality of leads extending from the patterned circuitry traces and hanging inside a plurality of through via holes. The via holes are aligned with and expose the terminal pads After attachment, an electrically conductive material connects the leads to the IC terminal pads through electrolytic plating, electroless (chemical) plating or solder re-flow processes. The conductive material provides mechanical support as well as electrical continuity between the IC chip and the circuitry of the substrate.

Abstract: A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes in which pre-formed strips or leads inside the via holes serve as the connections between the semiconductor device and substrate circuitry. The assembling steps include attaching an integrated circuit (IC) chip having a plurality of input/output terminal pads to a rigid or flexible substrate having a plurality of leads extending from the patterned circuitry traces and hanging inside a plurality of via holes. The via holes are aligned with and expose the terminal pads. After attachment, an electrically conductive material connects the leads to the IC terminal pads through electrolytic plating, electroless (chemical) plating or solder re-flow processes. The conductive material provides mechanical support as well as electrical continuity between the IC chip and the circuitry of the substrate.

Abstract: A flip chip assembly, and methods of forming the same, including a single or multilayer substrate having a plurality of via holes which serve as the connection between the semiconductor device and substrate circuitry. The method of manufacturing the flip chip assembly includes attaching an integrated circuit (IC) chip having a plurality of input/output terminal pads to a rigid or flexible substrate having a plurality of via holes. The via holes are aligned with the terminal pads so that the respective traces on the substrate can be connected to the respective terminal pads through the via holes. After attachment, the pre-deposited solder inside the via holes or on the terminal pads is re-flowed. This re-flow soldering process electrically connects the IC chip to the substrate. The soldering can be deposited by plating, wave soldering, meniscus coating, and screen printing techniques.

Abstract: A flip chip assembly, and methods of making the same, including a substrate having a plurality of via holes, wherein pre-formed strips or leads hanging in the via holes and conductive material filled in the via holes together serve as the electrical connection between a semiconductor device and substrate circuitry. The method of manufacturing the flip chip assembly includes attaching an integrated circuit (IC) chip having a plurality of input/output terminal pads to a rigid or flexible substrate having a plurality of leads extending from patterned circuitry traces and hanging inside a plurality of via holes. The via holes are aligned with and expose the terminal pads. After attachment, an electrically conductive material, for example adhesive or solder, is filled into the via holes thereby connecting the leads to the terminal pads. The conductive material not only provides mechanical support but also electrical continuity between the IC chip and the circuitry of the substrate.

Abstract: A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes or apertures of which pre-formed strips or wires inside the via holes serve as the connections between the semiconductor device and substrate circuitry. The assembling steps may include attaching an integrated circuit (IC) chip or chips to a rigid or flexible substrate circuitry having a plurality of pre-formed strips extended from the patterned circuitry and hanging inside a plurality of through holes. These through holes are aligned and placed on top of the terminal pads so that the respective traces on the substrate can be connected with the respective input/output terminal pads of the IC chip through the leads inside the via holes. After attachment, electrically conductive material is subsequently connected to these leads to the IC terminal pads through electrolytic plating, electroless (chemical) plating or solder re-flow processes.

Abstract: A flip chip assembly, and methods of making the same, including a substrate circuitry having a plurality of via apertures or holes, wherein preformed strips or wires hanging therein and filled conductive material together serve as the electrical connection between a semiconductor device and substrate circuitry. The method and device in accordance with the present invention may include attaching an integrated circuit (IC) chip to a rigid or flexible substrate circuitry having a plurality of pre-formed strips extending from patterned circuitry traces and hanging inside a plurality of through holes. These through holes are aligned and placed above the terminal pads so that the respective traces on the substrate can be readily connected to the respective input/output terminal pads of the IC chip through the leads inside the via apertures or holes.