Patents by Inventor Charles William Lentz

Charles William Lentz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6990256
    Abstract: An optical modulator includes first and second modulator segments. The first and second modulator segments form an optical signal path for an optical signal. The optical modulator also includes an electrical signal path capable of receiving and carrying a modulation signal, which is applied to the optical signal at the first and second modulation segments to generate a modulated optical signal. An inductive element may be disposed between electrical inputs to the first and second modulator segments. The optical modulator may be an electro-absorption modulator (EAM). The inductive element may be an inductor or a transmission line segment.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: January 24, 2006
    Assignee: TriQuint Technology Holding Co.
    Inventors: John Michael Geary, Joseph Michael Freund, Frank Stephen Walters, Thomas Gordon Beck Mason, Charles William Lentz
  • Patent number: 6895134
    Abstract: The invention is an optoelectronic device and method of fabrication where at least two optical devices are formed on a single semiconductor substrate, with each optical device including an active region such as a multi-quantum well region. The active devices are spatially separated and optically coupled by a passive waveguide formed over the substrate which provides butt joints with the active regions. The butt joints can be optimized independently from the active regions thus improving yield.
    Type: Grant
    Filed: November 10, 2001
    Date of Patent: May 17, 2005
    Assignee: Triquint Technology Holding Co.
    Inventors: Kenneth Gerard Glogovsky, Charles William Lentz, Abdallah Ougazzaden, Claude Lewis Reynolds, Jr.
  • Publication number: 20040202402
    Abstract: The invention is an optoelectronic device and method of fabrication where at least two optical devices are formed on a single semiconductor substrate, with each optical device including an active region such as a multi-quantum well region. The active devices are spatially separated and optically coupled by a passive waveguide formed over the substrate which provides butt joints with the active regions. The butt joints can be optimized independently from the active regions thus improving yield.
    Type: Application
    Filed: November 10, 2001
    Publication date: October 14, 2004
    Inventors: Kenneth Gerard Glogovsky, Charles William Lentz, Abdallah Ougazzaden, Claude Lewis Reynolds
  • Publication number: 20030235359
    Abstract: An optical modulator includes first and second modulator segments. The first and second modulator segments form an optical signal path for an optical signal. The optical modulator also includes an electrical signal path capable of receiving and carrying a modulation signal, which is applied to the optical signal at the first and second modulation segments to generate a modulated optical signal. An inductive element may be disposed between electrical inputs to the first and second modulator segments. The optical modulator may be an electro-absorption modulator (EAM). The inductive element may be an inductor or a transmission line segment.
    Type: Application
    Filed: June 20, 2002
    Publication date: December 25, 2003
    Inventors: John Michael Geary, Joseph Michael Freund, Frank Stephen Walters, Thomas Gordon Beck Mason, Charles William Lentz
  • Patent number: 6556605
    Abstract: A mesa stripe buried heterostructure semiconductor laser with no intediffusion of atoms between doped regions and a method of its formation are disclosed. A double dielectric mask is used to form the mesa stripe. The first mask is then partially etched and a Si-doped InP layer is selectively grown. The first and second mask are subsequently etched away and an InP(Zn) clad layer, along with a Zn-doped InGaAs contact layer, are formed. This way, the resulting structure has no contact between the InP(Zn) clad layer and the InP(Fe) layer, and the dopant atoms interdiffusion is suppressed.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: April 29, 2003
    Assignee: Triquent Technology Holding, Co.
    Inventors: Gleb E. Shtengel, Utpal Kumar Chakrabarti, Charles William Lentz, Charles H. Joyner, Abdallah Ougazzaden
  • Patent number: 6437868
    Abstract: A system for measuring the thickness of a wafer while it is being thinned this disclosed. The system and method provide integrating an optical reflectometer into a common wafer thinning apparatus. Using reflected optical signals from the top and bottom of the wafer, the thickness of the wafer is determined with time based calculations in real-time while thinning is occurring. Once the desired thickness has been reached, the thinning operation is halted. By performing the measurement in-situ, this system and a method prevent scrapping of wafers which are overthinned and the reloading of wafers which are too thick. Since an optical reflectometer is used, the measurement is contactless, and thus prevents possible damage to wafers during measurement.
    Type: Grant
    Filed: October 28, 1999
    Date of Patent: August 20, 2002
    Assignee: Agere Systems Guardian Corp.
    Inventors: David Gerald Coult, Duane Donald Wendling, Charles William Lentz, Bryan Phillip Segner, Gustav Edward Derkits, Wan-ning Wu, Franklin Roy Dietz