Patents by Inventor Charley Ogata

Charley Ogata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Decoupling capacitor for an integrated circuit and method of manufacturing thereof
    Publication number: 20060279904
    Abstract: A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.
    Type: Application
    Filed: August 21, 2006
    Publication date: December 14, 2006
    Inventors: Stanford Crane, Zsolt Horvath, Josh Nickle, Myoung-soo Jeon, Charley Ogata, Vincent Alcaria, Patrick Codd
  • Decoupling capacitor for an integrated circuit and method of manufacturing thereof
    Patent number: 7123465
    Abstract: A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: October 17, 2006
    Assignee: Silicon Bandwidth, Inc.
    Inventors: Stanford W. Crane, Jr., Zsolt Horvath, Josh Nickel, Myoung-soo Jeon, Charley Ogata, Vincent Alcaria, Patrick Codd
  • Decoupling capacitor for an integrated circuit and method of manufacturing thereof
    Publication number: 20060067031
    Abstract: A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.
    Type: Application
    Filed: September 24, 2004
    Publication date: March 30, 2006
    Inventors: Stanford Crane, Zsolt Horvath, Josh Nickel, Myoung-soo Jeon, Charley Ogata, Vincent Alcaria, Patrick Codd