Patents by Inventor Charlie Oh

Charlie Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging of semiconductor circuit in pre-molded plastic package
    Patent number: 5869883
    Abstract: An inexpensive pre-molded package for electronic semiconductor circuit with increased thermal extraction capability, improved electrical performance, improved dielectric constant of sealing medium, optically transmissive sealing lid, and partially reduced electromagnetic radiation. In one embodiment, the pre-molded package includes electronic semiconductor circuit, a plurality of electrically conductive leads, a heat spreader, a plurality of electrically conductive bond wires, and a seal lid. Preferably, a surface of the heat spreader remains exposed to the exterior of the pre-molded package. In another embodiment, the pre-molded package includes a semiconductor circuit, a plurality of electrically conductive leads, a heat spreader, a plurality of electrically conductive bond wires, and an optically transmissive seal lid.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: February 9, 1999
    Assignee: Stanley Wang, President PanTronix Corp.
    Inventors: Larry H. Mehringer, Charlie Oh