Abstract: A micro-electronic device includes a first electronic component and a second electronic component, and a substrate formed of a first semiconductor material for supporting the components. The first component and the second component each include an active layer formed at least partially from a second semiconductor material different from the first semiconductor material. The device further includes, for each of the components, a stack for maintaining electrical voltage, which stack is situated between the substrate and the active layer of the electronic component under consideration and which comprises two layers forming a junction P-N formed from the same semiconductor material as the substrate and which insulates the relevant active layer from the substrate. The assemblies respectively including the first component and the second component and their respective stack for maintaining electrical voltage are separated from each other by a barrier made of electrically insulating material.

Abstract: The invention relates to a device for interconnecting photovoltaic cells having contacts on their back side, comprising at least one layer of a woven produced from electrically insulating fibers, comprising at least one thread or tape section made of an electrically conductive material woven with said fibers and arranged so as to be flush with the surface of at least one region of the woven in order to form an electrical contact region intended to be connected to a contact pad located on the back side of a cell. The invention also relates to a module of interconnected photovoltaic cells having contacts on the back side, comprising an interconnecting device arranged along the back side of the cells, and a process for manufacturing such a module.

Abstract: The invention relates to a device for interconnecting photovoltaic cells having contacts on their back side, comprising at least one layer of a woven produced from electrically insulating fibres, comprising at least one thread or tape section made of an electrically conductive material woven with said fibres and arranged so as to be flush with the surface of at least one region of the woven in order to form an electrical contact region intended to be connected to a contact pad located on the back side of a cell. The invention also relates to a module of interconnected photovoltaic cells having contacts on the back side, comprising an interconnecting device arranged along the back side of the cells, and a process for manufacturing such a module.

Abstract: A process for making an encapsulation structure comprising the following steps: 1) make at least one portion of material capable of releasing at least one gas when said material is heated, the portion of material communicating with the inside of a hermetically closed cavity of the encapsulation structure, 2) heat all or part of said portion of material such that at least part of the gas is released from said portion of material in the cavity, and in which said portion of material capable of releasing at least one gas when said material is heated comprises elements trapped in said portion of material, said trapped elements being released from said portion of material in gaseous form when said material is heated.

Abstract: A process for making an encapsulation structure comprising the following steps: make at least one portion of material capable of releasing at least one gas when said material is heated, the portion of material communicating with the inside of a hermetically closed cavity of the encapsulation structure, heat all or part of said portion of material such that at least part of the gas is released from said portion of material in the cavity, and in which said portion of material capable of releasing at least one gas when said material is heated comprises elements trapped in said portion of material, said trapped elements being released from said portion of material in gaseous form when said material is heated.

Abstract: A method for encapsulating a micro component positioned on and/or in a substrate, including: depositing at least one sacrificial material covering the micro component, making a cap covering the sacrificial material, removing the sacrificial material via at least one opening formed through the cap and forming a cavity in which the micro component is positioned, depositing, at least on the cap, at least one layer of plugging material that plugs the at least one opening, and performing a localized deposition of at least one portion of mechanically reinforcing material of the cap, covering at least the cap, wherein the mechanically reinforcing material is not subsequently etched.

Abstract: It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11). The cap (12) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b), said stiffening member (12b) being located between two recessed areas (12c) of the top wall (12a) and having one end (14) at a distance from the recessed areas (12c) without coming into contact with the substrate (11).

Abstract: A method for encapsulating a micro component positioned on and/or in a substrate, including the following steps: depositing at least one sacrificial material covering the micro component, making a cap covering the sacrificial material, removing the sacrificial material via at least one opening formed through the cap, forming a cavity in which the micro component is positioned, depositing, on the cap, at least one layer of plugging material capable of plugging the opening, localized deposition of a portion of mechanically reinforcing material of the cap, covering at least the cap.

Abstract: An electronic emission device including plural electron beams including a first structure having a plurality of emission sources of electron beam, hybridized with a second structure including a plurality of diaphragm openings.

Abstract: The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4). Application in particular in MEMS.

Abstract: A process for manufacturing a device including a packaged microsystem. The manufactured device is in a form of a plane wafer, the microsystem being buried in the wafer. Therefore, the process is used to make a compound that may be used as a basis for other micro technology processes. Moreover, the process co-integrates electronic compounds when the device is being manufactured. The device is particularly suitable for MEMS, and particularly radiofrequency resonators.

Abstract: It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11) The cap (13) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b) said stiffening member (12b) being located between two recessed areas (12c) of the top wall (12a) and having one end (14) at a distance from the recessed areas (12c) without coming into contact with the substrate (11).

Abstract: This invention discloses a process for manufacturing a device (44) comprising a packaged microsystem (10?): the device manufactured according to the invention is in the form of a plane wafer, the microsystem (10?) being buried in the wafer. Therefore, the process according to the invention is used to make a compound that may be used as a basis for other micro technology processes. Moreover, the process according to the invention co-integrates electronic compounds (36, 38) when the device (44) is being manufactured. The device (44) according to the invention is particularly suitable for MEMS, and particularly radiofrequency resonators.

Abstract: The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4). Application in particular in MEMS.

Abstract: An electronic emission device including plural electron beams including a first structure having a plurality of emission sources of electron beam, hybridized with a second structure including a plurality of diaphragm openings.