Abstract: A sealable enclosure is disclosed that is configured to enclose an object that is to be heated, wherein heating of the sealable enclosure with the object sealed therein permits gas generated by the heating to vent out through a first micro-pore portion disposed in a fold of film layer. Initially, the generated gas is retained in the sealable enclosure. When the temperature of the strip of heat sensitive adhesive reaches a threshold temperature, the strip of heat sensitive adhesive releases so that fold opens, wherein the gas vents through the micro-pore portion disposed in the film layer out into an ambient region surrounding the sealable enclosure while preventing ambient contaminates in the ambient region from entering into the sealable enclosure.

Abstract: A sealable enclosure is disclosed that is configured to enclose an object that is to be heated, wherein heating of the sealable enclosure with the object sealed therein permits gas generated by the heating to vent out through a first micro-perforation portion disposed in a fold of film layer. Initially, the generated gas is retained in the sealable enclosure. When the temperature of the strip of heat sensitive adhesive reaches a threshold temperature, the strip of heat sensitive adhesive releases so that fold opens, wherein the gas vents through the micro-perforation portion disposed in the film layer out into an ambient region surrounding the sealable enclosure while preventing ambient contaminates in the ambient region from entering into the sealable enclosure.

Abstract: A sealable enclosure is disclosed that is configured to enclose an object that is to be heated, wherein heating of the sealable enclosure with the object sealed therein permits gas generated by the heating to vent out through a first micro-perforation portion disposed in a fold of film layer. Initially, the generated gas is retained in the sealable enclosure. When the temperature of the strip of heat sensitive adhesive reaches a threshold temperature, the strip of heat sensitive adhesive releases so that fold opens, wherein the gas vents through the micro-perforation portion disposed in the film layer out into an ambient region surrounding the sealable enclosure while preventing ambient contaminates in the ambient region from entering into the sealable enclosure.

Abstract: A sealable enclosure is disclosed that is configured to enclose an object that is to be heated, wherein heating of the sealable enclosure with the object sealed therein permits gas generated by the heating to vent out through a first micro-pore portion disposed in a fold of film layer. Initially, the generated gas is retained in the sealable enclosure. When the temperature of the strip of heat sensitive adhesive reaches a threshold temperature, the strip of heat sensitive adhesive releases so that fold opens, wherein the gas vents through the micro-pore portion disposed in the film layer out into an ambient region surrounding the sealable enclosure while preventing ambient contaminates in the ambient region from entering into the sealable enclosure.

Abstract: A sealable enclosure is disclosed that is configured to enclose an object that is to be heated, wherein heating of the sealable enclosure with the object sealed therein permits gas generated by the heating to vent out through a first micro-perforation portion disposed in an enclosure, wherein the gas vents into a cavity formed between the outside surface of the enclosure, a lower surface of a file layer, and a strip of heat sensitive adhesive. When the temperature of the strip of heat sensitive adhesive reaches a threshold temperature, the strip of heat sensitive adhesive releases so that the gas may vent from the cavity through a second micro-perforation portion disposed in the film layer out into an ambient region surrounding the sealable enclosure while preventing ambient contaminates in the ambient region from entering into the sealable enclosure.