Abstract: Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention. In addition, a metal foil and the polyimide resin formed from the cyclization have excellent adhesive strength, high flat degree, and excellent electrical property.

Abstract: The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.

Abstract: The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.

Abstract: The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.

Abstract: A polyamic acid resin composition, and a polyimide film and laminate prepared therefrom are provided. The polyamic acid resin composition includes a polyamic acid resin, a solvent, and a polar aprotic solution containing nanoscale silica, with surface hydroxyl groups, modified by a surface modification agent. Particularly, the surface modification agent has a structure represented by formula (I): R1—Si—(OR2)3??formula (I) wherein, R1 is an aliphatic group or an aryl group, and R2 is a C1-8 alkyl group.

Abstract: Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention.

Abstract: The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.

Abstract: A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Ar1 represents a bivalent aromatic group, and Ar2 represents a bivalent aromatic group containing an OH or COOH group.

Abstract: The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C?C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.

Abstract: A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Ar1 represents a bivalent aromatic group, and Ar2 represents a bivalent aromatic group containing an OH or COOH group.

Abstract: A thermoplastic polyimide composition characterized by improved thermal resistance, adhesion and flatness for use in copper clad laminates. The polyimide contains repeating units represented by the formulae I and II, wherein each of Ar1 and Ar2, independently, represents a bivalent aromatic group, and X represents a quadrivalent aromatic group.

Abstract: The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C?C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.

Abstract: A coating composition of positive photosensitive polyimide is disclosed, which includes an organic solvent and the following components dissolved in the organic solvent: (a) a polyimide having a phenolic hydroxyl group or carboxyl group at the end of a principal chain of the polymer; (b) a compound having a phenolic hydroxyl group; and (c) a quinonediazide sulfonate as a photosensitive agent. The amount of the components (b) and (c) are 1-50 parts by weight per 100 parts by weight the component (a) in the coating composition. A film of the coating composition can be developed with an alkaline aqueous solution, which has a high photosensitivity, excellent resolution, low post-cure temperature, high film residual rate in thickness, and a pattern having a tapered-angle at the cross section. The coating solution can be used for forming an insulating layer in displays or in other suitable applications.

Abstract: The present invention relates to ink jet recording materials and method for making the same. The material has a gel layer formed on a base material to improve the optical density of the material and improve the printing quality of ink of pigment type. The method for forming the gel layer is to coat a first ink-receptive layer composed of high valance metallic halide, such as calcium chloride (CaCl2) or magnesium chloride (MgCl2), on the base layer, then a second ink-receptive layer composed of alginate, such as sodium alginate, potassium alginate or other compounds of alginic acid, on the first ink-receptive layer. The second and the first ink-receptive layers will react to form a gel layer during coating for absorbing ink dots and improving print quality.

Abstract: An ink jet printing medium is disclosed. It contains (a) a substrate; (b) an ink absorption layer; and (c) a reinforcement layer sandwiched between said substrate and said ink absorption layer. The reinforcement layer, which is provided at a thickness about 5% to 100% of a thickness of said ink absorption layer, comprises: (a) a carboxylated acrylonitrile rubber at about 7 to 25 wt %; (b) an epoxy resin containing at least two epoxy groups, about 45 to 70 wt %; (c) a hardener containing at least two functional groups, provided at an equivalent ratio of between about 0.9 and 1.1 relative to said epoxy resin; and (d) a catalyst. The inkjet printing medium exhibits excellent adhesion between the ink absorption medium and the substrate, and improved water resistance without affecting printing quality.