Patents by Inventor Chase Berry

Chase Berry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8064220
    Abstract: Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: November 22, 2011
    Assignee: Dell Products L.P.
    Inventors: Chase Berry, Gary Thomason, James Utz, Steven L. Williams, Jorge C. Marcet
  • Publication number: 20090231788
    Abstract: Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.
    Type: Application
    Filed: February 21, 2008
    Publication date: September 17, 2009
    Inventors: Chase Berry, Gary Thomason, James Utz, Steven L. Williams, Jorge C. Marcet
  • Patent number: 6525267
    Abstract: A chassis discontinuity seal includes a gasket member comprising a compressible material with an interruption on its peripheral surface and a flexible sealing material spanning the interruption. The gasket member is placed on a first surface for sealing engagement with a mating closure surface. The compressible material has a first density and the interruption defines an elongated portion of the gasket having a second density, less than the first density. The gasket may be used in any shielding enclosure where it is desirable to reduce the compression force while maintaining high surface conductivity.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: February 25, 2003
    Assignee: Dell Products L.P.
    Inventors: Richard Worley, Chase Berry