Patents by Inventor Chase Joslin

Chase Joslin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Highly aligned fiber nozzle for additive manufacturing applications
    Patent number: 12515402
    Abstract: An additive manufacturing system for an additive manufacturing material and embedded short-chopped fibers includes an extruder comprising a nozzle having a nozzle flow channel. The nozzle includes a plurality of spaced apart elongated aligning structures distributed inside the nozzle flow channel and parallel to the longitudinal center axis defining alignment flow channels within the nozzle flow channel. A nozzle for additive manufacturing, a method of additive manufacturing, and a method of making a nozzle for an additive manufacturing system for and additive manufacturing material and embedded short-chopped fibers are also disclosed.
    Type: Grant
    Filed: September 29, 2023
    Date of Patent: January 6, 2026
    Assignee: UT-BATTELLE, LLC
    Inventors: Tyler C. Smith, Ahmed A. Hassen, John M. Lindahl, Seokpum Kim, Vlastimil Kunc, Vipin Kumar, Chase Joslin
  • HIGHLY ALIGNED FIBER NOZZLE FOR ADDITIVE MANUFACTURING APPLICATIONS
    Publication number: 20240383196
    Abstract: An additive manufacturing system for an additive manufacturing material and embedded short-chopped fibers includes an extruder comprising a nozzle having a nozzle flow channel. The nozzle includes a plurality of spaced apart elongated aligning structures distributed inside the nozzle flow channel and parallel to the longitudinal center axis defining alignment flow channels within the nozzle flow channel. A nozzle for additive manufacturing, a method of additive manufacturing, and a method of making a nozzle for an additive manufacturing system for and additive manufacturing material and embedded short-chopped fibers are also disclosed.
    Type: Application
    Filed: September 29, 2023
    Publication date: November 21, 2024
    Inventors: Tyler C. Smith, Ahmed A. Hassen, John M. Lindahl, Seokpum Kim, Vlastimil Kunc, Vipin Kumar, Chase Joslin