Abstract: Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.

Abstract: Inlay (40) comprising a substrate (41) and a first zigzag portion (42) formed of a metal wire (421) embedded in an upper face (43) of the substrate (41), the first zigzag portion (42) comprising, alternately, rectilinear segments (422) and bends (423), at least one of the rectilinear segments (422) of the first zigzag portion (42) being disposed, at least in part, in a zone (45) of the upper face (43) of the substrate (41) configured to form a spotface of a cavity of an electronic document, and the inlay (40) comprising a connection wire (47) configured to join together at least the rectilinear segments (422) of the first zigzag portion (42). Method for producing an electronic document (1) comprising such an inlay (40), and electronic document (1).