Patents by Inventor Chase R. Perry

Chase R. Perry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temporary chip attach structure with thin films
    Publication number: 20030104687
    Abstract: A temporary chip attach (TCA) structure is made with two layers of thin films. The first layer contains capture pads to capture the positional error of the underlying chip carrier vias. The second layer contains smaller TCA pads of exposed metal which are accurately aligned to the grid of the chip BLM, as well as appropriate alignment features for use by a chip automatic placement tool.
    Type: Application
    Filed: December 4, 2001
    Publication date: June 5, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Enrique C. Abreu, Rmar M. Ahmad, Gregory M. Johnson, Robert W. Pasco, Chase R. Perry, Brenda Peterson