Abstract: A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G?, of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 ?m/min.

Abstract: A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G?, of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 ?m/min.

Abstract: A method for polishing a substrate using a pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, wherein the polymeric matrix is applied on a permeable substrate, and wherein the polishing pad exhibits reduced defectivity and improved polishing performance are provided.

Abstract: A method for polishing a substrate using a pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, wherein the polymeric matrix is applied on a permeable substrate, and wherein the polishing pad exhibits reduced defectivity and improved polishing performance are provided.

Abstract: The present invention provides a chemical mechanical polishing pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, wherein the pad comprises: a Shore A hardness of 30 to 70; a void volume fraction of 0.2 to 80 percent; a tensile strength of 1 mPa to 5 mPa; and a percent elongation of 200 to 400.

Abstract: A support belt to be used with a polishing belt. The support belt includes an interior layer made of a polymer, wherein said interior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a first seam and an adhesive placed on an exterior surface of the interior layer. An exterior layer made of a polymer and attached to the adhesive, wherein the exterior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a second seam.

Abstract: A polishing pad includes a flexible substrate and a polymeric polishing layer that has a repeatable pattern of polymeric asperities that are manufactured by printing, according to a gravure printing process or a screen printing process.

Abstract: A highly filled surface covering, preferably a floor covering and more preferably a floor tile, includes a resin layer which has about 80% to about 95% by weight of filler and a chlorine-free binder. The binder includes a mixture of a maleic anhydride grafted polyethylene and a substantially linear ethylene/octene copolymer. The ratio of maleic anhydride grafted polyethylene and ethylene/octene copolymer is from about 1:5 to about 1:15 by weight. The preferred formulation for the binder includes a solid tackifier selected from the group consisting of a hydrocarbon resin having an ester moiety and hydrogenated aromatic resin.

Abstract: The present invention relates to a three-stage UV curing process whereby a UV-curable substrate is initially exposed to long wave length light of low intensity, thereby causing the bottom portion of the substrate to gel while leaving the top surface essentially unaffected. The first stage irradiation is followed by irradiation with shorter-wave length UV light under an inert atmosphere, thereby causing the surface of the substrate to gel. The final stage of the curing process involves conventional exposure to strong UV light whereby the entire structure is cured to give a product having finely controlled surface texture. The resulting products are useful as surface coverings, and particularly as floor and wall coverings.