Abstract: A method of manufacturing a MESFET using ceramic materials includes providing a substrate; providing a ceramic semiconductor material to apply onto the substrate to form a first ceramic semiconductor layer; providing a ceramic semiconductor material which is blended with ions, wherein the ceramic semiconductor material is applied onto a central part of the first ceramic semiconductor layer to form a second ceramic semiconductor layer with ions; providing another ion-mixed ceramic semiconductor material is provided to apply over both sides of the first ceramic semiconductor layer to form a third ceramic semiconductor layer having ions; and respectively plating the second and third ceramic semiconductor layers with metal layers so that the second ceramic semiconductor layer has a gate electrode and the third ceramic semiconductor layer has a source and a drain. A transistor obtained by this method can be put into broader range of applications compared to III-V group transistor.

Abstract: A method of manufacturing a MESFET using ceramic materials includes providing a substrate; providing a ceramic semiconductor material to apply onto the substrate to form a first ceramic semiconductor layer; providing a ceramic semiconductor material which is blended with ions, wherein the ceramic semiconductor material is applied onto a central part of the first ceramic semiconductor layer to form a second ceramic semiconductor layer with ions; providing another ion-mixed ceramic semiconductor material is provided to apply over both sides of the first ceramic semiconductor layer to form a third ceramic semiconductor layer having ions; and respectively plating the second and third ceramic semiconductor layers with metal layers so that the second ceramic semiconductor layer has a gate electrode and the third ceramic semiconductor layer has a source and a drain. A transistor obtained by this method can be put into broader range of applications compared to III-V group transistor.

Abstract: A photolithography process using a photoresist is as following. A substrate is provided for coating a photoresist thereon to form a photoresist layer and the photoresist is formed by mixing photocatalyst particles and polymer binder in a solvent. The photoresist layer is well-adhesive and has good mechanical strength. A light is illuminated on the photoresist layer through a photo mask having a pre-designed pattern thereon. Then, the portion of the photoresist layer where the light projects is removed by water or another environment-friendly solvent so as to reduce the harmful waste produced in the processes.