Patents by Inventor Chaun-Yu Wu

Chaun-Yu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package structure and method for making the same
    Patent number: 9159660
    Abstract: A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: October 13, 2015
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Chih-Hsien Ni, Lung-Hua Ho, Chaun-Yu Wu, Kung-An Lin
  • Semiconductor package structure and method for making the same
    Patent number: 8658466
    Abstract: A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: February 25, 2014
    Assignee: Chipbond Technology Corporation
    Inventors: Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Chih-Hsien Ni, Lung-Hua Ho, Chaun-Yu Wu, Kung-An Lin
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
    Publication number: 20140027905
    Abstract: A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.
    Type: Application
    Filed: October 1, 2013
    Publication date: January 30, 2014
    Applicant: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Chih-Hsien Ni, Lung-Hua Ho, Chaun-Yu Wu, Kung-An Lin
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
    Publication number: 20130334681
    Abstract: A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.
    Type: Application
    Filed: June 18, 2012
    Publication date: December 19, 2013
    Applicant: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Chin-Tang Hsieh, Chih-Ming Kuo, Chia-Jung Tu, Shih-Chieh Chang, Chih-Hsien Ni, Lung-Hua Ho, Chaun-Yu Wu, Kung-An Lin