Patents by Inventor Chaur Yang Ng

Chaur Yang Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210366875
    Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.
    Type: Application
    Filed: December 30, 2020
    Publication date: November 25, 2021
    Inventors: Xiaofeng Di, Junrong Yan, CheeKeong Chin, Weili Wang, Xin Lu, Qi Deng, Chaur Yang Ng, Cong Zhang, Chenlin Yang, Chin-Tien Chiu