Patents by Inventor Chavdar Kamenov

Chavdar Kamenov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminated temperature sensor
    Patent number: 8333506
    Abstract: A temperature sensor is formed from three initially unfired (or green) ceramic substrates. The first substrate has a temperature sensitive means printed on a first surface. Additionally first and second conducting elements are also printed thereon. The third substrate has a temperature sensitive means in the form of a resistor printed on a first surface. Additionally first and second conducting elements and are also printed thereon. The second substrate is provided with a conducting via in the form of a hole extending through the substrate, the hole being filled with conductive material. The via is adapted to be aligned with the ends of conducting elements. To construct the sensor the first surfaces of substrates are aligned with substrate such that via is aligned with conducting elements. The substrates are then pressed together. Subsequently the substrates are fired to provide the completed sensor.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: December 18, 2012
    Assignee: MELEXIS NV Microelectronic Integrated Systems
    Inventors: Chavdar Kamenov, Petar Mitsev, Peter Tilmans, Jos Rennies
  • LAMINATED TEMPERATURE SENSOR
    Publication number: 20100034237
    Abstract: A temperature sensor is formed from three initially unfired (or green) ceramic substrates. The first substrate has a temperature sensitive means printed on a first surface. Additionally first and second conducting elements are also printed thereon. The third substrate has a temperature sensitive means in the form of a resistor printed on a first surface. Additionally first and second conducting elements and are also printed thereon. The second substrate is provided with a conducting via in the form of a hole extending through the substrate, the hole being filled with conductive material. The via is adapted to be aligned with the ends of conducting elements. To construct the sensor the first surfaces of substrates are aligned with substrate such that via is aligned with conducting elements. The substrates are then pressed together. Subsequently the substrates are fired to provide the completed sensor.
    Type: Application
    Filed: July 30, 2009
    Publication date: February 11, 2010
    Applicant: MELEXIS NV Microelectronic Integrated Systems
    Inventors: Chavdar Kamenov, Petar Mitsev, Peter Tilmans, Jos Rennies