Abstract: Systems and methods for computerized time tracking are disclosed. In one aspect, a computer-implemented device is disclosed. The device comprises a memory storing instructions, a network device, a display device, and at least one processor configured to execute the instructions. The instructions direct the processor to determine a location of the device based on one or more network signals; based on the determined location, display a first user interface element that, when selected, records a start time associated with a user identifier; receive a selection of the first user interface element; after receiving a selection of the first user interface element, display a second user interface element that, when selected, records an end time associated with the user identifier; receive a selection of the second user interface element; and send at least one of the start time or the end time to a remote server via the network device.

Abstract: The drum includes a drum body provided with at least one opening, and a balance ring passing through the at least one opening and detachably connected to the drum body.

Abstract: Disclosed herein is a washing machine in which a balancer is directly mounted on a body of an inner tub without a front surface part of the inner tub. The washing machine includes an outer tub to store water, a body formed in a cylindrical shape provided with an opening at one surface thereof and provided in the outer tub, and a balancer connected to an inner diameter part at the opening of the body to reduce unbalance of the body generated during rotation of the body and to reinforce the body.

Abstract: A handle device includes a securing unit secured to a baggage item, a handle unit, a locking unit and a scale unit. The handle unit is coupled separably to the securing unit and is formed with a receiving space. The locking unit is operable between a locked state, where the handle unit is secured to the securing unit, and an unlocked state, where the handle unit is permitted to be disposed above and separated from the securing unit. The scale unit is connected pivotally to the handle unit, and is pivotable downwardly from a closed state to be confined in the receiving space, to an opened state, where the locking unit is at the unlocked state and the scale unit is perpendicular to the handle unit for measuring the weight of the baggage item.

Abstract: A handle device includes a securing unit secured to a baggage item, a handle unit, a locking unit and a scale unit. The handle unit is coupled separably to the securing unit and is formed with a receiving space. The locking unit is operable between a locked state, where the handle unit is secured to the securing unit, and an unlocked state, where the handle unit is permitted to be disposed above and separated from the securing unit. The scale unit is connected pivotally to the handle unit, and is pivotable downwardly from a closed state to be confined in the receiving space, to an opened state, where the locking unit is at the unlocked state and the scale unit is perpendicular to the handle unit for measuring the weight of the baggage item.

Abstract: A semiconductor device assembly or package includes at least one semiconductor device that is positioned adjacent to floating leads. Such an assembly or package may include at least two semiconductor devices that face opposite directions from one another, with each being oriented such that bond pads thereof are at an opposite side of the assembly or package from bond pads of the other. Alternatively, an assembly or package may include a lead assembly with an internal portion, including one or more floating leads, and an external portion that are in planes that are offset relative to one another. Methods for designing lead frames, assemblies, and packages are also disclosed, as are assembly and packaging methods.

Abstract: The drum includes a drum body provided with at least one opening, and a balance ring passing through the at least one opening and detachably connected to the drum body.

Abstract: A bush member for a rotating shaft of a washing machine wherein a manufacturing process of the bush member is simplified and the bush member has a small thickness, a washing machine having the bush member, and a manufacturing method of the bush member and the washing machine. The bush member is formed by pressing a raw material without sintering. The bush member has a thickness of 0.3 mm to 0.7 mm. The bush member has a taper inclined to achieve secure coupling between the bush member and the rotating shaft and a curled part formed at the lower end thereof.

Abstract: A method and apparatus for increasing the integrated circuit density in a flip-chip semiconductor device assembly including an interposer substrate facilitating use with various semiconductor die conductive bump arrangements. The interposer substrate includes a plurality of recesses formed in at least one of a first surface and a second surface thereof, wherein the recesses are arranged in a plurality of recess patterns. The interposer substrate also provides enhanced accessibility for test probes for electrical testing of the resulting flip-chip semiconductor device assembly.

Abstract: Disclosed herein is a washing machine in which a balancer is directly mounted on a body of an inner tub without a front surface part of the inner tub. The washing machine includes an outer tub to store water, a body formed in a cylindrical shape provided with an opening at one surface thereof and provided in the outer tub, and a balancer connected to an inner diameter part at the opening of the body to reduce unbalance of the body generated during rotation of the body and to reinforce the body.

Abstract: An instrument cluster assembly includes an outer gauge that is disposed about an inner gauge. The inner gauge is flood lit and the outer gauge is back lit. A single light guide assembly receives light from a plurality of light source exposed about an outer perimeter of the outer gauge. Light directed through the light guide is emitted through a light emitting edge to illuminate the inner gauge. Light traveling from the light source through the light guide is uniformly transmitted through a curved transition portion to back light the outer gauge assembly.

Abstract: A light guide assembly for illuminating an instrument surface includes a continuous curved transition portion for uniformly directing and transmitting light from a light source to a backlight surface of the instrument surface. The curved shape of the transition portion is tailored to transmit a desired amount of light into the backlight portion and a desired amount outwardly against a back surface of the instrument surface.

Abstract: A semiconductor device assembly or package includes at least one semiconductor device that is positioned adjacent to floating leads. Such an assembly or package may include at least two semiconductor devices that face opposite directions from one another, with each being oriented such that bond pads thereof are at an opposite side of the assembly from bond pads of the other. Alternatively, an assembly or package may include a lead assembly with an internal portion, including one or more floating leads, and an external portion that are in planes that are offset relative to one another. Methods for designing lead frames, assemblies, and packages are also disclosed, as are assembly and packaging methods.

Abstract: A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The method may also include configuring the carrier substrate to include one or more recessed areas that laterally surround at least a portion of the die-attach location to receive excess adhesive.

Abstract: An apparatus and method for improving the yield and reducing the cost of forming a semiconductor device assembly. An interposer substrate is formed with interconnections in the form of conductive bumps on both a first surface and a second surface to provide a respective first level interconnect and a second level interconnect for a semiconductor die to be mounted to the interposer substrate. The conductive bumps and conductive elements may be formed simultaneously by a plating process. The conductive bumps on the first surface are arranged to correspond with bond pads of a semiconductor die for the first level interconnect. The conductive bumps on the second surface are configured to correspond with a terminal pad pattern of a carrier substrate or other higher-level packaging.

Abstract: A light guide assembly for illuminating an instrument surface includes a continuous curved transition portion for uniformly directing and transmitting light from a light source to a backlight surface of the instrument surface. The curved shape of the transition portion is tailored to transmit a desired amount of light into the backlight portion and a desired amount outwardly against a back surface of the instrument surface.

Abstract: An instrument cluster assembly includes an outer gauge that is disposed about an inner gauge. The inner gauge is flood lit and the outer gauge is back lit. A single light guide assembly receives light from a plurality of light source exposed about an outer perimeter of the outer gauge. Light directed through the light guide is emitted through a light emitting edge to illuminate the inner gauge. Light traveling from the light source through the light guide is uniformly transmitted through a curved transition portion to back light the outer gauge assembly.

Abstract: Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.