Abstract: Disclosed is a method and device for interconnection of printed circuit boards operating at millimeter wave frequency band. The device comprises a primary printed circuit board, a secondary printed circuit board, an interconnection module for coupling electromagnetic energy from the primary printed circuit board to the secondary printed circuit board. The primary printed circuit board further comprising a primary top dielectric layer, specific via arrangements, a radio frequency chip, a primary high frequency transmission line connected to the radio frequency chip at one end and other end to a first inset-fed patch. The secondary printed circuit board further comprising a secondary top dielectric layer, specific via arrangements, a printed array antenna, a secondary high frequency transmission line connected to printed array antenna at one end, and other end to a second inset-fed patch. The interconnection module further comprising a first cut-out section, a second cut-out section and a slot.