Abstract: A system for bonding films includes a first film, a second film having a plurality of elements, a bonding roller, and a deformable roller having a deformable outer layer. The stiffness of the second film is less than that of the first film. By using the system, the deformable outer layer of the deformable roller produces enough deformation during bonding films to fill the area not covered by the plurality of elements on the second film. Therefore, the second film without sufficient stiffness and the first film can be bonded with each other to produce a composite film without wrinkles. A method for preparing a composite film using the system is also disclosed.

Abstract: An active single-ended transmission cable is disclosed. The active single-ended transmission cable allows connection between a first and a second electronic device and comprises a first port, a second port, and a transmission wire. The first or second port is used for receiving or transmitting a differential signal between the first and the second electronic devices, and for converting between a differential signal and a single-ended signal. The transmission wire is used for transmitting the single-ended signal. This allows the conversion between the received or transmitted differential signal at the first and second ports into the single-ended signal so as to allow the transmission of the single-ended signal within the transmission wire.

Abstract: A user equipment (UE) executes a semi-static channel access method in an unlicensed band. The UE receives a first downlink control information (DCI) within a fixed frame period (FFP), wherein the first DCI is for scheduling uplink (UL) transmissions over one or more FFPs. The UE derives, for each scheduled UL transmission of the scheduled UL transmissions, a channel occupancy time (COT) initiator of the scheduled UL transmission. The UE determines one or more transmission symbols for each of the scheduled UL transmissions according to the derived COT initiator. The UE transmits each of the scheduled UL transmissions in the one or more transmission symbols of the one or more FFPs.

Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first wafer is provided. The first wafer includes a first substrate and a first device layer. A second wafer is provided. The second wafer includes a second substrate and a second device layer. The second device layer is bonded to the first device layer. An edge trimming process is performed on the first wafer and the second wafer to expose a first upper surface of the first substrate and a second upper surface of the first substrate and to form a damaged region in the first substrate below the first upper surface and the second upper surface. The second upper surface is higher than the first upper surface. A first photoresist layer is formed. The first photoresist layer is located on the second wafer and the second upper surface and exposes the first upper surface and the damaged region. The damaged region is removed by using the first photoresist layer as a mask. The first photoresist layer is removed.

Abstract: A manufacturing method of a lithium battery negative electrode includes the following. A copper foil is providing. An electroplating process is performed to form a lithium deposition layer on the copper foil. An electrolyte solution used in the electroplating process includes an organic solvent and fluorine-containing lithium salt. The organic solvent includes ester solvents, ether solvents, alcohol solvents, or combinations thereof, and the fluorine-containing lithium salt includes LiPF6, LiFSI, LiTF, LiDFOB, LiTFSI, or combinations thereof.

Abstract: An encoder includes circuitry and memory coupled to the circuitry. The circuitry, in operation, generates a first coefficient value by applying a CCALF (cross component adaptive loop filtering) process to a first reconstructed image sample of a luma component, and generates a second coefficient value by applying an ALF (adaptive loop filtering) process to a second reconstructed image sample of a chroma component. The circuitry modifies the first coefficient value by performing an arithmetic right shift by 7 bits on the first coefficient value. The circuitry generates a third coefficient value by adding the modified first coefficient value to the second coefficient value, and encodes a third reconstructed image sample of the chroma component using the third coefficient value.

Abstract: The present disclosure relates to a video processing method for an application and an electronic device. The method comprises: receiving a configuration instruction for an audio during an editing process of a video; and configuring the audio during a shooting process of the video in response to the configuration instruction, and displaying a microphone control in a shooting page of the video in a case where a configuration result indicates that the audio is configured during the shooting process of the video; wherein recording of an original sound is configured during the shooting process of the video when the microphone control is in an on state, and not recording of the original sound is configured during the shooting process of the video when the microphone control is in an off state.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a fluoropolymer. The fluoropolymer has a plurality of spherulites, and the fractal dimension of each spherulite is lower than 12.

Abstract: The present application relates to the technical field of heating clothing, specifically to a heating clothing control device and a heating clothing. The heating clothing control device includes a control circuit board, connection wires and a housing with a plurality of heating control modules. An indicator light control module and a plurality of heating control modules are provided on the control circuit board. Each accommodation area is provided therein with a limit plate. The control circuit board is placed in the housing to make the indicator light control module and the plurality of heating control modules be clipped in different accommodation areas and respectively abut against the limiting plates. The present application divides the operating areas of different heating control modules by arranging a plurality of accommodation areas in the housing to reduce the influence of a certain heating control module on other heating control modules during operation.

Abstract: Implementations described herein relate to techniques and apparatuses related to a structure that may be used for characterizing properties related to an interfacial adhesion strength between an epoxy mold compound and a vertical edge of a semiconductor die included in a semiconductor die package. The techniques and apparatuses may be used to provide a more comprehensive understanding of interfacial adhesion strengths within the semiconductor die package relative to techniques available in semiconductor industry standards.

Abstract: In a method for inspecting pattern defects, a plurality of patterns are formed over an underlying layer. The plurality of patterns are electrically isolated from each other. A part of the plurality of patterns are scanned with an electron beam to charge the plurality of patterns. An intensity of secondary electrons emitted from the scanned part of the plurality of patterns is obtained. One or more of the plurality of patterns that show an intensity of the secondary electrons different from others of the plurality of patterns are searched.

Abstract: A method for forming a semiconductor structure includes the following steps. A first trench is formed in a semiconductor substrate, and a first nitride layer is formed along a sidewall and a bottom surface of the first trench. A first oxide layer is formed over the first nitride layer to fill the first trench, and the first oxide layer is recessed from the first trench to form a first recess. A portion of the first nitride layer exposed from the first recess is etched, and a second nitride layer is formed along a sidewall and a bottom surface of the first recess. The second nitride layer includes a first portion along the bottom surface and a second portion along the sidewall. The second portion is removed, and a second oxide layer is formed over the first portion to fill the first recess.

Abstract: Provided are a method and system for controlling interactive live streaming co-hosting, a device, and a medium. The method includes acquiring a first interactive image and receiving a mirror interactive image of a second terminal by a first terminal, where the first terminal and the second terminal are in a live streaming co-hosting state, and the mirror interactive image of the second terminal is obtained by performing mirror processing on a second interactive image of the second terminal; and combining the first interactive image and the mirror interactive image by the first terminal to obtain a target interactive image.

Abstract: Apparatuses, systems, and techniques to generate an image of an environment. In at least one embodiment, one or more neural networks are used to identify one or more static and dynamic features of an environment to be used to generate a representation of the environment.

Abstract: A stacked via structure disposed on a conductive pillar of a semiconductor die is provided. The stacked via structure includes a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer, a second conductive via, and a second redistribution wiring. The first dielectric layer covers the semiconductor die. The first conductive via is embedded in the first dielectric layer and electrically connected to the conductive pillar. The first redistribution wiring covers the first conductive via and the first dielectric layer. The second dielectric layer covers the first dielectric layer and the first redistribution wiring. The second conductive via is embedded in the second dielectric layer and landed on the first redistribution wiring. The second redistribution wiring covers the second conductive via and the second dielectric layer. A lateral dimension of the first conductive via is greater than a lateral dimension of the second conductive via.

Abstract: An electronic device and a method of training a classification model for age-related macular degeneration (AMD) are provided. The method includes the following steps. Training data is obtained. A loss function vector corresponding to the training data is calculated based on a machine learning algorithm, in which the loss function vector includes a first loss function value corresponding to a first classification of AMD and a second loss function value corresponding to a second classification of AMD, the first classification corresponds to a first group, and the second classification corresponds to one of the first group and a second group. The first loss function value is updated according to the second loss function value and a group penalty weight in response to the second classification corresponding to the second group to generate an updated loss function vector. The classification model is trained according to the updated loss function vector.

Abstract: A peptide is described herein that has: (i) a simple structure compared to existing natural human erythropoietin, thus capable of easily passing through a tissue-blood barrier, (ii) excellent bioactivity with respect to cell-protecting activity, (iii) a low manufacturing cost, thus being economically advantageous, and (iv) no side effects on cell proliferation. Also, a pharmaceutical composition comprising the erythropoietin-derived peptide described herein as an active ingredient is described. The pharmaceutical composition may be used for preventing or treating cell damage-related illnesses, such as stroke, mechanical damage or ischemic damage to the nervous system, myocardial infarction, retinal damage, and diabetes. Also, the described pharmaceutical composition may be used for preventing cell damage.

Abstract: A wideband antenna system includes a first metal radiation portion, having a coupling distance with a second metal radiation portion; a first feeding contact and a second feeding contact, electrically connected to the first metal radiation portion and the second metal radiation portion respectively, and close to the coupling distance; a first ground contact, electrically connected to the second metal radiation portion; a second ground contact, electrically connected to the first metal radiation portion; an impedance tuner, electrically connected to the first feeding contact, the second feeding contact, the first ground contact, the second ground contact, and a radio frequency signal source, to switch the first metal radiation portion and the second metal radiation portion; an aperture contact, electrically connected to the first metal radiation portion; and an aperture tuner, electrically connected to the aperture contact.

Abstract: A gas filling docking tray having a carrier substrate includes a base surface, a plurality of guide blocks, a plurality of positioning pins, and at least one pair of nozzles. The guide blocks are at least disposed on two opposite sides of the base surface to define a wafer carrier accommodation area, and each guide block includes a vertical portion substantially perpendicular to the base surface and an inclined portion located above and connected with the vertical portion. A height of an apex of each positioning pin relative to the base surface is greater than a height of an apex of the vertical portion and less than a height of an apex of the inclined portion relative to the base surface.

Abstract: A memory device has a plurality of bit cells, each of which includes an SRAM cell having a storage node selectively connectable to a first bit line in response to a control signal received on a first word line. Each bit cell further includes an MRAM cell selectively connectable to the storage node of the SRAM cell in response to a control signal received on a second word line.