Abstract: An electronic apparatus performs a method of decoding video data. The method includes receiving, from the video signal, a picture frame that includes a first component and a second component, receiving, from the video signal, a plurality of sample offsets associated with the second component, reconstructing the samples of the first component before a first in-loop filter module, reconstructing the samples of the second component after a second in-loop filter module, determining a classifier for the second component from one or more reconstructed samples of the first component relative to each sample of the second component, selecting a sample offset from the plurality of sample offsets for the second component according to the classifier, and modifying the reconstructed samples of the second component based on the selected sample offset.

Abstract: A semiconductor package includes a redistribution structure, a first conductive pillar and a second conductive pillar, and a semiconductor device. The redistribution structure has a first surface and a second surface opposite to the first surface. The first conductive pillar and the second conductive pillar are disposed on the first surface of the redistribution structure and electrically connected with the redistribution structure, wherein a maximum lateral dimension of the first conductive pillar is greater than a maximum lateral dimension of the second conductive pillar, and a topography variation of a top surface of the first conductive pillar is greater than a topography variation of a top surface of the second conductive pillar.

Abstract: A semiconductor device includes a first transistor cell. The first transistor cell generates a first current signal and a second current signal indicating a bit of a physical unclonable function. The first transistor cell includes a first transistor, a second transistor and a third transistor. The first transistor outputs the first current signal. The second transistor generates the first current signal from a first source/drain structure of the second transistor, and generates the second current signal from a second source/drain structure of the second transistor. The third transistor outputs the second current signal. The first transistor, the second transistor and the third transistor are stacked in order along a first direction. The first source/drain structure of the second transistor and the second source/drain structure of the second transistor are arranged along a second direction different from the first direction.

Abstract: Semiconductor devices, methods of manufacturing the semiconductor device and tools are disclosed herein. Some methods include providing an electrostatic chuck and placing an edge ring adjacent to the electrostatic chuck. The electrostatic chuck includes a first electrode to generate a sheath at a first distance over the electrostatic chuck. The edge ring includes a coil and a second electrode to generate an electric field control to maintain a portion of the sheath over the edge ring in a coplanar orientation with the portion of the sheath over the electrostatic chuck.

Abstract: An optical module includes a housing and a release mechanism. The housing includes an outer lateral surface. The release mechanism includes an arm and a releasing component. The arm is disposed on the outer lateral surface and movable relative to the housing. The releasing component is disposed on the outer lateral surface and includes a pivot, a releasing portion and a pressed portion. The pivot is between the releasing portion and the pressed portion. The pivot is disposed on the housing. The arm pushes the pressed portion to pivot the releasing component. At an idle state of the release mechanism, a movement of the housing is restricted by an interference between a flexible counterpart of a cage and the housing. At a releasing state of the release mechanism, the releasing portion deforms the flexible counterpart, thereby removing the interference between the flexible counterpart and the housing.

Abstract: An electronic apparatus performs a method of decoding a video signal. The method comprises: receiving the video signal that includes a first component and a second component in a first picture frame; receiving, from the video signal, a plurality of sample offsets associated with the second component in the first picture frame; deriving a first class index for the second component from a first set of one or more samples of the first component relative to each sample of the second component; selecting a first sample offset from the plurality of sample offsets for the second component according to the first class index; and obtaining a cross-component offsetted sample value of the second component based on the first sample offset in the first picture frame. In some embodiments, the first picture frame is divided into a plurality of regions, and a different classifier is used for each of the plurality of regions.

Abstract: A collection and test device for a rapid test is provided. The device comprises a test fluid accommodation part having a test fluid accommodation space, a test paper accommodation part having a test paper accommodation space, and a collection probe having a channel for the test fluid to flow out from the collection probe. The two ends of the test paper accommodation part are respectively connected to the test fluid accommodation part and the collection probe, and the test paper accommodation space communicates with the channel of the collection probe. The test fluid accommodation space and the test paper accommodation space are separated from each other by a temporary barrier. The temporary barrier can be manually removed or broken to make the test fluid accommodation space communicate with the test paper accommodation space. The device of the present invention can provide the test results conveniently and rapidly.

Abstract: A key structure includes a keycap, a connecting member, a fixing member, a light emitter and a light receiver. The connecting member is connected to an inner top surface of the keycap and extends downwards, and the connecting member has a first opening through the connecting member. The fixing member has a second opening through the fixing member, in which when the keycap is initially pressed and then continues to be pressed, the keycap moves in a direction, and the connecting member moves with the keycap, and an overlapping region defined by the first opening and the second opening gradually becomes larger or smaller. The light emitter is laterally adjacent to the second opening of the fixing member. The light receiver is laterally adjacent to the first opening of the connecting member.

Abstract: A semiconductor device includes a substrate with a high voltage region and a low voltage region. A first deep trench isolation is disposed within the high voltage region. The first deep trench isolation includes a first deep trench and a first insulating layer filling the first deep trench. The first deep trench includes a first sidewall and a second sidewall facing the first sidewall. The first sidewall is formed by a first plane and a second plane. The edge of the first plane connects to the edge of the second plane. The slope of the first plane is different from the slope of the second plane.

Abstract: A display may have a stretchable portion with hermetically sealed rigid pixel islands. A flexible interconnect region may be interposed between the hermetically sealed rigid pixel islands. The hermetically sealed rigid pixel islands may include organic light-emitting diode (OLED) pixels. A conductive cutting structure may have an undercut that causes a discontinuity in a conductive OLED layer to mitigate lateral leakage. The conductive cutting structure may also be electrically connected to a cathode for the OLED pixels and provide a cathode voltage to the cathode. First and second inorganic passivation layers may be formed over the OLED pixels. Multiple discrete portions of an organic inkjet printed layer may be interposed between the first and second inorganic passivation layers.

Abstract: An optical module is provided, including a movable part, a fixed part, a first driving assembly, and a first circuit assembly. The movable part is for connecting a first optical element. The movable part may move relative to the fixed part. The first driving assembly is for driving the movable part to move relative to the fixed part, and the first circuit assembly is for electrically connecting the first driving assembly.

Abstract: A method of forming a semiconductor device package is provided. The method includes bonding a first package component and a second package component to a substrate, wherein the first and second package components are different types of electronic components that provide different functions; attaching at least one dummy die to the substrate, wherein the dummy die is electrically isolated from the substrate, wherein the first and second package components are disposed on two opposite sides of the dummy die; and disposing an underfill element between the substrate, the first package component, the second package component, and the dummy die, wherein the underfill element extends up along the sidewalls of the dummy die and laterally surrounds the sidewalls of the dummy die in a top view, wherein the underfill element has a maximum height lower than the top surface of the dummy die.

Abstract: Provided are an integrated circuit (IC) and a method of forming the same. The IC includes a substrate; a conductive layer, disposed on the substrate; a barrier layer, disposed on the conductive layer; an etching stop layer, covering a sidewall of the barrier layer and extending on a first portion of a top surface of the barrier layer; and at least one capacitor structure, disposed on a second portion of the top surface of the barrier layer.

Abstract: Techniques for concentrating analytes in fluid samples are described. An example method performed by a concentrator includes receiving a fluid sample; concentrating an analyte in the fluid sample by extracting water from the fluid sample; and based on concentrating the analyte in the fluid sample, outputting the fluid sample. The analyte is concentrated by extracting the water through a membrane and into a solution including at least one solute at a concentration that is greater than a concentration of at least one solute in the fluid sample, diameters of pores extending through the membrane being shorter than a diameter of the analyte and shorter than a diameter of the at least one solute.

Abstract: A method for fabricating a semiconductor device includes the steps of first providing a substrate having an active region as the substrate includes a medium-voltage (MV) region and a low-voltage (LV) region, forming a first divot adjacent to one side of the active region, forming a second divot adjacent to another side of the active region, forming a first liner in the first divot and the second divot and on the substrate of the MV region and LV region, forming a second liner on the first liner, and then removing the second liner, the first liner, and the substrate on the LV region for forming a fin-shaped structure.

Abstract: A semiconductor package structure includes a semiconductor die encapsulated in a molding compound, a redistribution structure over the semiconductor die and the molding compound, a surface device over and electrically connected to the redistribution structure, a first connector over and electrically connected to the redistribution structure, a second connector between the surface device and the redistribution structure, a trench in the redistribution structure and laterally surrounding the surface device in a top view of the semiconductor package structure, and an underfill. The second connector electrically connects the surface device to the redistribution structure. The underfill surrounds the second connector. The underfill include a first portion and a second portion. The first portion of the underfill is located between the surface device and the redistribution structure and laterally surrounding the second connector, and the second portion of the underfill is disposed in the trench.

Abstract: A bonded assembly of a first wafer including a first semiconductor substrate and a second wafer including a second semiconductor substrate may be formed. The second semiconductor substrate may be thinned to a first thickness, and an inter-wafer moat trench may be formed at a periphery of the bonded assembly. A protective material layer may be formed in the inter-wafer moat trench and over the backside surface of the second semiconductor substrate. A peripheral portion of the second semiconductor substrate located outside the inter-wafer moat trench may be removed, and a cylindrical portion of the protective material layer laterally surrounds a remaining portion of the bonded assembly. The second semiconductor substrate may be thinned to a second thickness by performing at least one thinning process while the cylindrical portion of the protective material layer protects the remaining portion of the bonded assembly.

Abstract: An object detection system includes a projector that projects an original transmitted light on a scene containing an object; an adjustable device configured to shape the original transmitted light, thereby generating a shaped transmitted light; and an image capture device configured to capture an image from a reflected light from the scene. The original transmitted light is alternated with the shaped transmitted light, thereby resulting in an integrated image captured by the image capture device.

Abstract: A method of adaptively controlling rendered contents in an electronic device is provided. After starting an APP on the electronic device, the current content status of the APP is monitored on a real-time basis. The contents of the APP are presented with an adjustable graphic quality which is adaptively adjusted based on the current content status of the APP for providing optimized balance between power consumption and user experience.

Abstract: Methods for video decoding and encoding, apparatuses and non-transitory storage media are provided. In one decoding method, the decoder obtains a first candidate position and a second candidate position. The decoder obtains a third candidate position based on the first and second candidate positions and obtains a virtual block based on the first, the second, and the third candidate positions. The decoder may obtain a plurality of CPMVs for the virtual block based on translational MVs at the first, second, and third candidate positions; and project, the plurality of CPMVs for the virtual block to a current block to obtain a translational MV based on a specific position within the current block or a second plurality of CPMVs for the current block.