Abstract: A semiconductor package structure includes a semiconductor die encapsulated in a molding compound, a redistribution structure over the semiconductor die and the molding compound, a surface device over and electrically connected to the redistribution structure, a first connector over and electrically connected to the redistribution structure, a second connector between the surface device and the redistribution structure, a trench in the redistribution structure and laterally surrounding the surface device in a top view of the semiconductor package structure, and an underfill. The second connector electrically connects the surface device to the redistribution structure. The underfill surrounds the second connector. The underfill include a first portion and a second portion. The first portion of the underfill is located between the surface device and the redistribution structure and laterally surrounding the second connector, and the second portion of the underfill is disposed in the trench.

Abstract: A method for fabricating a semiconductor device includes the steps of first providing a substrate having an active region as the substrate includes a medium-voltage (MV) region and a low-voltage (LV) region, forming a first divot adjacent to one side of the active region, forming a second divot adjacent to another side of the active region, forming a first liner in the first divot and the second divot and on the substrate of the MV region and LV region, forming a second liner on the first liner, and then removing the second liner, the first liner, and the substrate on the LV region for forming a fin-shaped structure.

Abstract: A bonded assembly of a first wafer including a first semiconductor substrate and a second wafer including a second semiconductor substrate may be formed. The second semiconductor substrate may be thinned to a first thickness, and an inter-wafer moat trench may be formed at a periphery of the bonded assembly. A protective material layer may be formed in the inter-wafer moat trench and over the backside surface of the second semiconductor substrate. A peripheral portion of the second semiconductor substrate located outside the inter-wafer moat trench may be removed, and a cylindrical portion of the protective material layer laterally surrounds a remaining portion of the bonded assembly. The second semiconductor substrate may be thinned to a second thickness by performing at least one thinning process while the cylindrical portion of the protective material layer protects the remaining portion of the bonded assembly.

Abstract: Techniques for concentrating analytes in fluid samples are described. An example method performed by a concentrator includes receiving a fluid sample; concentrating an analyte in the fluid sample by extracting water from the fluid sample; and based on concentrating the analyte in the fluid sample, outputting the fluid sample. The analyte is concentrated by extracting the water through a membrane and into a solution including at least one solute at a concentration that is greater than a concentration of at least one solute in the fluid sample, diameters of pores extending through the membrane being shorter than a diameter of the analyte and shorter than a diameter of the at least one solute.

Abstract: An object detection system includes a projector that projects an original transmitted light on a scene containing an object; an adjustable device configured to shape the original transmitted light, thereby generating a shaped transmitted light; and an image capture device configured to capture an image from a reflected light from the scene. The original transmitted light is alternated with the shaped transmitted light, thereby resulting in an integrated image captured by the image capture device.

Abstract: Methods for video decoding and encoding, apparatuses and non-transitory storage media are provided. In one decoding method, the decoder obtains a first candidate position and a second candidate position. The decoder obtains a third candidate position based on the first and second candidate positions and obtains a virtual block based on the first, the second, and the third candidate positions. The decoder may obtain a plurality of CPMVs for the virtual block based on translational MVs at the first, second, and third candidate positions; and project, the plurality of CPMVs for the virtual block to a current block to obtain a translational MV based on a specific position within the current block or a second plurality of CPMVs for the current block.

Abstract: A method of adaptively controlling rendered contents in an electronic device is provided. After starting an APP on the electronic device, the current content status of the APP is monitored on a real-time basis. The contents of the APP are presented with an adjustable graphic quality which is adaptively adjusted based on the current content status of the APP for providing optimized balance between power consumption and user experience.

Abstract: A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, a first package component, a second package component, and at least one dummy die. The first and second package components are disposed over and bonded to the substrate. The first and second package components are different types of electronic components that provide different functions. The dummy die is disposed over and attached to the substrate. The dummy die is located between the first and second package components and is electrically isolated from the substrate.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion. The driving assembly is used for driving the movable portion to move relative to the fixed portion.

Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes a base material made of one or more of a Cr based material, an Ir based material, a Pt based material, or Co based material, and further contains one or more additional elements selected from the group consisting of Si, B, Ge, Al, As, Sb, Te, Se and Bi.

Abstract: A semiconductor device includes a semiconductor stack; a substrate formed on the semiconductor stack, including a lower surface connected to the semiconductor stack, an upper surface opposite to the lower surface, and a side surface between the lower surface and the upper surface, wherein the side surface includes a mirror area, a first scribing area, and a first crack area, the mirror area is closer to the lower surface than the first scribing area to the lower surface, and the first scribing area is located between the mirror area and the first crack area; an optical structure on the upper surface of the substrate; and a reflective structure on a side surface of the first scribing area and the first crack area, wherein the first scribing area is arranged below the upper surface of the substrate with a distance less than or equal to ¼ of a thickness of the substrate.

Abstract: A three-dimensional (3D) sensing device is configured to sense an object. The 3D sensing device includes a flood light source, a structured light source, an image sensor, and a controller. The controller is configured to perform: commanding the flood light source and the structured light source to emit a flood light and a structured light in sequence; commanding the image sensor to sense a first reflective light and a second reflective light in sequence, so as to obtain a first image frame and a second image frame; combining the first image frame and the second image frame into a determination frame; and determining that the object is a specular reflection object in response to determining that the determination frame has at least two spots having gray levels satisfying a predetermined condition. A specular reflection object detection method is also provided.

Abstract: An optical transceiver includes a housing, circuit board, first heat source and heat conductive component. The housing includes first and second housing stacked on each other and together form accommodation space. The circuit board is disposed in the accommodation space. The circuit board has first and second surface. The first surface and the second surface face away from each other. The first surface faces the first housing. The second surface faces the second housing. The first heat source is disposed on the second surface of the circuit board and electrically connected to the circuit board. The heat conductive component is disposed on the first surface and thermally coupled to the first housing. Size of projection of the heat conductive component onto the second surface is larger than size of projection of the first heat source onto the second surface.

Abstract: An electronic apparatus performs a method of decoding video data. The method comprises: receiving the video signal that includes a first component and a second component; receiving a plurality of offsets associated with the second component; utilizing a characteristic measurement of the first component to obtain a classification category associated with the second component; selecting an offset from the plurality of offsets for the second component according to the classification category; and modifying the second component based on the selected offset. In some embodiments, the first component is a luma video component and the second component is a chroma video component.

Abstract: A static random access memory (SRAM) cell includes a first pull-up (PU) transistor comprising a first gate structure. The SRAM cell further includes a second PU transistor comprising a second gate structure, wherein the second gate structure comprises a gate stack and gate spacers. The SRAM cell further includes a first butted contact, wherein the first butted contact electrically connects a first terminal of the first PU transistor to the second gate structure, wherein the first butted contact directly contacts each of a top surface and a sidewall of the gate stack.

Abstract: A method for image-guided agriculture includes receiving images; processing the images to generate reflectance maps respectively corresponding to spectral bands; synthesizing the reflectance maps to generate a multispectral image including vegetation index information of a target area; receiving crop information in regions of the target area; and assessing crop conditions for the regions based on the identified crop information and the vegetation index information.

Abstract: A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

Abstract: In an automated detection system for acute ischemic stroke, a preprocessor performs registration on a whole-brain image and a standard-brain spatial template to extract individual brain region masks from the whole-brain image. A deep learning encoder performs feature extraction on the whole-brain image and the individual brain region masks, thereby converting the whole-brain image into 2D whole-brain slice images. A first processor maps the individual brain masks onto the whole-brain slice images for registration, thereby generating sets of brain region slice images. A second processor computes the stroke-related weight values of the slice images of each of the sets of brain region slice images and sums the weight values to obtain the characteristic value of each brain region. A disparity-aware classifier determines whether any brain region has acute ischemic stroke according to the characteristic value of each brain region.

Abstract: Methods and devices are provided for video coding. In the method, a decoder may receive a picture frame including one or more components, where the one or more components include a first component and a second component. The decoder determines a classifier for a respective sample of the second component according to a collocated sample of the first component; obtains an indicator that indicates one or more bandNum segments of the one or more components in response to determining that the classifier is a band classifier or a joint classifier encompassing the band classifier; determines, according to the indicator and from a mapping table, the one or more bandNum segments and determining a band offset according to the one or more bandNum segments; and modifies the respective sample of the second component according to a sample offset including the band offset.

Abstract: A method of video decoding, apparatuses and non-transitory computer-readable storage media thereof are provided. The method of video decoding includes obtaining a first parameter based on a first neighbor block of a current block; obtaining a second parameter based on the first neighbor block and/or a second neighbor block of the current block; constructing an affine model using the first parameter and the second parameter; and obtaining a control point motion vector (CPMV) for the current block based on the affine model. The first neighbor block and the second neighbor block are obtained from a plurality of neighbor blocks to the current block based on at least one scanning area and at least one scanning distance. The first neighbor block and the second neighbor block are obtained by scanning the at least one scanning area at the at least one scanning distance.