Abstract: A mobile communication device is provided with a processor. The processor is configured to receive a request for starting a Mobile Originated (MO) service, determine a plurality of remaining usage quotas for the MO service, which correspond to a plurality of subscriber numbers, and select one of the subscriber numbers for starting the MO service according to the remaining usage quotas.

Abstract: A method for displaying SIM card slot information for use in a device including M SIM card slots, each of which may have a SIM card inserted therein or no SIM card inserted therein. The method includes the following steps. A set of predetermined rules are first determined by the device. Statuses of the M SIM card slots corresponding to the set of predetermined rules are then acquired. Information regarding N of the M SIM card slots are displayed on a display unit of the device according to the set of predetermined rules determined by the current associated network and the acquired statuses of the M SIM card slots, where N<M and N>=1.

Abstract: A mobile communication device is provided with a processor. The processor is configured to receive a request for starting a Mobile Originated (MO) service, determine a plurality of remaining usage quotas for the MO service, which correspond to a plurality of subscriber numbers, and select one of the subscriber numbers for starting the MO service according to the remaining usage quotas.

Abstract: A method for displaying SIM card slot information for use in a device including M SIM card slots, each of which may have a SIM card inserted therein or no SIM card inserted therein. The method includes the following steps. A set of predetermined rules are first determined by the device. Statuses of the M SIM card slots corresponding to the set of predetermined rules are then acquired. Information regarding N of the M SIM card slots are displayed on a display unit of the device according to the set of predetermined rules determined by the current associated network and the acquired statuses of the M SIM card slots, where N<M and N>=1.

Abstract: A method for calculating leakage current associated with an integrated circuit, includes selecting a sampling point at which an input signal for the integrated circuit is in a quiescent state and determining the leakage current associated with the integrated circuit using the selected sampling point.

Abstract: A water dispersible granule includes the ingredients of wetting agent, dispersing agent, binder, disintegratant, acid, base, carrier and pesticide, wherein the above ingredients are combined to be 100%. All the above components of insecticide are mixed with water and extruded. The extruded material is baked in an oven that has operation temperature set from 40° C. to 50° C. and the baked material ground into small granules by machine or manpower.

Abstract: A heat dissipation assembly comprises a printed circuit board (PCB) (20), a chip (30) and a heat sink (10). The PCB comprises a grounding circuit and four through apertures (22) in the grounding circuit. The chip is mounted on the PCB, and is surrounded by the through apertures. The heat sink has four metal columns (16) depending from a bottom surface of a base (12) thereof, the columns corresponding to the four through apertures. A method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.

Abstract: A heat dissipation assembly comprises a printed circuit board (PCB) (20), a chip (30) and a heat sink (10). The PCB comprises a grounding circuit and four through apertures (22) in the grounding circuit. The chip is mounted on the PCB, and is surrounded by the through apertures. The heat sink has four metal columns (16) depending from a bottom surface of a base (12) thereof, the columns corresponding to the four through apertures. A method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.

Abstract: A process is provided for generating a synoptic layout database for efficient layout parasitic extraction and circuit simulation in post-layout verification of an integrated circuit (IC) design for a system having a plurality of repetitive subcircuits. The process includes the steps of: receiving an input layout database including a plurality of geometric objects including cells representing the IC design, each of the cells including a plurality of polygons; identifying a plurality of repetitive cells of the input layout database, the repetitive cells being associated with the repetitive sub-circuits; recognizing at least one pattern of the repetitive cells; defining at least one cut region of the input layout database, the cut region being defined by physical layout coordinates, the cut region intersecting a corresponding pattern of the repetitive cells; and generating a synoptic layout database.